SiHU3N50DA
Vishay Siliconix
www.vishay.com
D Series Power MOSFET
FEATURES
PRODUCT SUMMARY
• Optimal design
VDS (V) at TJ max.
DS(on) max. at 25 °C (Ω)
Qg (max.) (nC)
550
- Low area specific on-resistance
- Low input capacitance (Ciss
R
VGS = 10 V
3.2
)
12
2
- Reduced capacitive switching losses
- High body diode ruggedness
- Avalanche energy rated (UIS)
• Optimal efficiency and operation
- Low cost
Q
gs (nC)
gd (nC)
Q
3
Configuration
Single
D
- Simple gate drive circuitry
- Low figure-of-merit (FOM): Ron x Qg
- Fast switching
IPAK
(TO-251)
D
G
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
S
N-Channel MOSFET
S
D
G
• Consumer electronics
- Displays (LCD or plasma TV)
• Server and telecom power supplies
- SMPS
• Industrial
- Welding, induction heating, motor drives
• Battery chargers
ORDERING INFORMATION
Package
IPAK (TO-251)
Lead (Pb)-free and Halogen-free
SiHU3N50DA-GE3
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
Gate-Source Voltage AC (f > 1 Hz)
VDS
500
30
V
VGS
30
3.0
T
C = 25 °C
Continuous Drain Current (TJ = 150 °C)
VGS at 10 V
ID
TC = 100 °C
1.9
A
Pulsed Drain Currenta
IDM
5.5
Linear Derating Factor
Single Pulse Avalanche Energyb
0.56
9
W/°C
mJ
W
EAS
PD
Maximum Power Dissipation
69
Operating Junction and Storage Temperature Range
Drain-Source Voltage Slope
Reverse Diode dV/dtd
TJ, Tstg
-55 to +150
24
°C
TJ = 125 °C
for 10 s
dV/dt
V/ns
°C
0.22
300
Soldering Recommendations (Peak Temperature)c
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature.
b. VDD = 50 V, starting TJ = 25 °C, L = 2.3 mH, Rg = 25 Ω, IAS = 2.8 A.
c. 1.6 mm from case.
d. ISD ≤ ID, starting TJ = 25 °C.
S14-1304-Rev. A, 23-Jun-14
Document Number: 91615
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000