IRF9540S, SiHF9540S
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• Halogen-free According to IEC 61249-2-21
Definition
• Surface Mount
• Available in Tape and Reel
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• P-Channel
• 175 °C Operating Temperature
• Fast Switching
• Compliant to RoHS Directive 2002/95/EC
- 100
VGS = - 10 V
RDS(on) ()
0.20
Qg (Max.) (nC)
61
14
Q
Q
gs (nC)
gd (nC)
29
Configuration
Single
S
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
D2PAK (TO-263)
G
The D2PAK (TO-263) is a surface mount power package
capable of accommodating die sizes up to HEX-4. It
provides the highest power capability and the lowest
possible on-resistance in any existing surface mount
package. The D2PAK (TO-263) is suitable for high current
applications because of its low internal connection
resistance and can dissipate up to 2.0 W in a typical surface
mount application.
D
G
D
P-Channel MOSFET
S
ORDERING INFORMATION
Package
D2PAK (TO-263)
D2PAK (TO-263)
Lead (Pb)-free and Halogen-free
SiHF9540S-GE3
IRF9540SPbF
SiHF9540S-E3
SiHF9540STRL-GE3a
IRF9540STRLPbFa
SiHF9540STL-E3a
Lead (Pb)-free
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
- 100
20
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
V
TC = 25 °C
TC = 100 °C
- 19
- 13
Continuous Drain Current
VGS at - 10 V
ID
A
Pulsed Drain Currenta
IDM
- 72
Linear Derating Factor
1.0
0.025
640
W/°C
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
EAS
IAR
mJ
A
- 19
Repetitive Avalanche Energya
EAR
15
mJ
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
150
3.7
- 5.5
- 55 to + 175
300d
T
C = 25 °C
PD
W
V/ns
°C
dV/dt
TJ, Tstg
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = - 25 V, starting TJ = 25 °C, L = 2.7 mH, Rg = 25 , IAS = - 19 A (see fig. 12).
c. ISD - 19 A, dI/dt 200 A/μs, VDD VDS, TJ 175 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material)
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91079
S11-1051-Rev. C, 30-May-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000