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SIHF640S-E3 PDF预览

SIHF640S-E3

更新时间: 2024-11-27 06:11:39
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 2115K
描述
Power MOSFET

SIHF640S-E3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:D2PAK
包装说明:SMALL OUTLINE, R-PSSO-G2针数:4
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.08
Is Samacsys:N其他特性:AVALANCHE RATED
雪崩能效等级(Eas):580 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:200 V
最大漏极电流 (Abs) (ID):18 A最大漏极电流 (ID):18 A
最大漏源导通电阻:0.18 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):130 W
最大脉冲漏极电流 (IDM):72 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SIHF640S-E3 数据手册

 浏览型号SIHF640S-E3的Datasheet PDF文件第2页浏览型号SIHF640S-E3的Datasheet PDF文件第3页浏览型号SIHF640S-E3的Datasheet PDF文件第4页浏览型号SIHF640S-E3的Datasheet PDF文件第5页浏览型号SIHF640S-E3的Datasheet PDF文件第6页浏览型号SIHF640S-E3的Datasheet PDF文件第7页 
IRF640S, IRF640L, SiHF640S, SiHF640L  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Surface Mount  
PRODUCT SUMMARY  
VDS (V)  
200  
Available  
• Low-Profile Through-Hole  
R
DS(on) (Ω)  
VGS = 10 V  
0.18  
RoHS*  
• Available in Tape and Reel  
• Dynamic dV/dt Rating  
• 150 °C Operating Temperature  
• Fast Switching  
Qg (Max.) (nC)  
70  
13  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
39  
Configuration  
Single  
• Fully Avalanche Rated  
• Lead (Pb)-free Available  
D
I2PAK  
(TO-262)  
D2PAK  
(TO-263)  
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combinations of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
G
G
D
S
The D2PAK is a surface mount power package capable of  
accommodating die size up to HEX-4. It provides the highest  
power capability and the last lowest possible on-resistance in  
any existing surface mount package. The D2PAK is suitable  
for high current applications because of its low internal  
connection resistance and can dissipate up to 2.0 W in a  
typical surface mount application. The through-hole version  
(IRF640L/SiHF640L) is available for low-profile applications.  
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
D2PAK (TO-263)  
D2PAK (TO-263)  
IRF640STRRPbFa  
SiHF640STR-E3a  
IRF640STRRa  
I2PAK (TO-262)  
IRF640LPbF  
SiHF640L-E3  
IRF640L  
IRF640SPbF  
SiHF640S-E3  
IRF640S  
IRF640STRLPbFa  
SiHF6340STL-E3a  
IRF640STRLa  
Lead (Pb)-free  
SnPb  
SiHF640S  
SiHF640STLa  
SiHF640STRa  
SiHF640L  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
200  
V
VGS  
20  
TC = 25 °C  
TC =100°C  
18  
Continuous Drain Current  
V
GS at 10 V  
ID  
11  
A
Pulsed Drain Currenta, e  
Linear Derating Factor  
Single Pulse Avalanche Energyb, e  
Avalanche Currenta  
IDM  
72  
1.0  
W/°C  
mJ  
A
EAS  
IAR  
580  
18  
Repetiitive Avalanche Energya  
EAR  
13  
mJ  
T
C = 25 °C  
3.1  
Maximum Power Dissipation  
PD  
W
V/ns  
°C  
TA = 25 °C  
130  
Peak Diode Recovery dV/dtc, e  
dV/dt  
5.0  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 150  
300d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, starting TJ = 25 °C, L = 2.7 mH, RG = 25 Ω, IAS = 18 A (see fig. 12).  
c. ISD 18 A, dI/dt 150 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. Uses IRF640/SiHF640 data and test conditions.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91037  
S-81241-Rev. A, 07-Jul-08  
www.vishay.com  
1

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