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SIHF540STRR-GE3 PDF预览

SIHF540STRR-GE3

更新时间: 2024-11-01 09:25:35
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
9页 175K
描述
Power MOSFET

SIHF540STRR-GE3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:D2PAK
包装说明:SMALL OUTLINE, R-PSSO-G2针数:4
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.08Is Samacsys:N
其他特性:AVALANCHE RATED雪崩能效等级(Eas):230 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (Abs) (ID):28 A
最大漏极电流 (ID):28 A最大漏源导通电阻:0.077 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):150 W最大脉冲漏极电流 (IDM):110 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SIHF540STRR-GE3 数据手册

 浏览型号SIHF540STRR-GE3的Datasheet PDF文件第2页浏览型号SIHF540STRR-GE3的Datasheet PDF文件第3页浏览型号SIHF540STRR-GE3的Datasheet PDF文件第4页浏览型号SIHF540STRR-GE3的Datasheet PDF文件第5页浏览型号SIHF540STRR-GE3的Datasheet PDF文件第6页浏览型号SIHF540STRR-GE3的Datasheet PDF文件第7页 
IRF540S, SiHF540S  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
Halogen-free According to IEC 61249-2-21  
Definition  
100  
• Surface Mount  
R
DS(on) ()  
VGS = 10 V  
0.077  
• Available in Tape and Reel  
• Dynamic dV/dt Rating  
• Repetitive Avalanche Rated  
• 175 °C Operating Temperature  
• Fast Switching  
Qg (Max.) (nC)  
Qgs (nC)  
72  
11  
Q
gd (nC)  
32  
Configuration  
Single  
• Ease of Paralleling  
• Compliant to RoHS Directive 2002/95/EC  
D
DESCRIPTION  
D2PAK (TO-263)  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
G
The D2PAK (TO-263) is a surface mount power package  
capable of accommodating die size up to HEX-4. It provides  
the highest power capability and the lowest possible  
on-resistance in any existing surface mount package. The  
D2PAK (TO-263) is suitable for high current applications  
because of its low internal connection resistance and can  
dissipate up to 2.0 W in a typical surface mount application.  
D
G
S
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
Lead (Pb)-free and Halogen-free  
D2PAK (TO-263)  
SiHF540S-GE3  
IRF540SPbF  
D2PAK (TO-263)  
SiHF540STRL-GE3a  
IRF540STRLPbFa  
SiHF540STL-E3a  
D2PAK (TO-263)  
SiHF540STRR-GE3a  
IRF540STRRPbFa  
SiHF540STR-E3a  
Lead (Pb)-free  
SiHF540S-E3  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
Drain-Source Voltage  
Gate-Source Voltage  
SYMBOL  
LIMIT  
100  
20  
UNIT  
VDS  
VGS  
V
TC = 25 °C  
C = 100 °C  
28  
Continuous Drain Current  
VGS at 10 V  
ID  
T
20  
A
Pulsed Drain Currenta  
IDM  
110  
1.0  
Linear Derating Factor  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Avalanche Currenta  
0.025  
230  
28  
EAS  
IAR  
mJ  
A
Repetitive Avalanche Energya  
EAR  
15  
mJ  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
T
C = 25 °C  
150  
3.7  
PD  
W
V/ns  
°C  
TA = 25 °C  
dV/dt  
5.5  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 175  
300d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 25 V, starting TJ = 25 °C, L = 440 μH, Rg = 25 , IAS = 28 A (see fig. 12).  
c. ISD 28 A, dI/dt 170 A/μs, VDD VDS, TJ 175 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91022  
S11-1046-Rev. D, 30-May-11  
www.vishay.com  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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