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SIGC06T60GSX1SA2 PDF预览

SIGC06T60GSX1SA2

更新时间: 2024-11-21 20:10:39
品牌 Logo 应用领域
英飞凌 - INFINEON 功率控制晶体管
页数 文件大小 规格书
4页 72K
描述
Insulated Gate Bipolar Transistor, 10A I(C), 600V V(BR)CES, N-Channel, 2.44 X 2.42 MM, DIE-2

SIGC06T60GSX1SA2 技术参数

生命周期:Active包装说明:UNCASED CHIP, R-XUUC-N2
Reach Compliance Code:compliant风险等级:5.6
最大集电极电流 (IC):10 A集电极-发射极最大电压:600 V
配置:SINGLEJESD-30 代码:R-XUUC-N2
元件数量:1端子数量:2
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:UNCASED CHIP极性/信道类型:N-CHANNEL
表面贴装:YES端子形式:NO LEAD
端子位置:UPPER晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):296 ns
标称接通时间 (ton):22 nsBase Number Matches:1

SIGC06T60GSX1SA2 数据手册

 浏览型号SIGC06T60GSX1SA2的Datasheet PDF文件第2页浏览型号SIGC06T60GSX1SA2的Datasheet PDF文件第3页浏览型号SIGC06T60GSX1SA2的Datasheet PDF文件第4页 
SIGC06T60GS  
IGBT3 Chip  
FEATURES:  
This chip is used for:  
·
·
·
·
·
·
600V Trench & Field Stop technology  
low VCE(sat)  
low turn-off losses  
short tail current  
positive temperature coefficient  
easy paralleling  
C
·
·
power module  
discrete components  
Applications:  
·
·
·
drives  
white goods  
resonant applications  
G
E
Chip Type  
SIGC06T60GS  
VCE  
ICn  
10A  
Die Size  
Package  
Ordering Code  
Q67050-  
A4333-A101  
600V  
2.44 x 2.42 mm2  
sawn on foil  
MECHANICAL PARAMETER:  
Raster size  
2.44 x 2.42  
Emitter pad size  
Gate pad size  
1.558 x 1.577  
0.361 x 0.513  
5.9 / 3.6  
70  
mm2  
Area total / active  
Thickness  
mm2  
µm  
Wafer size  
150  
mm  
deg  
Flat position  
270  
Max. possible chips per wafer  
Passivation frontside  
Emitter metallization  
2485 pcs  
Photoimide  
3200 nm AlSiCu  
1400 nm Ni Ag –system  
suitable for epoxy and soft solder die bonding  
Collector metallization  
Die bond  
electrically conductive glue or solder  
Wire bond  
Al, <500µm  
Reject ink dot size  
Æ 0.65mm ; max 1.2mm  
store in original container, in dry nitrogen,  
< 6 month at an ambient temperature of 23°C  
Recommended storage environment  
Edited by INFINEON Technologies AI PS DD CLS, L7521D, Edition 1, 09.06.2004  

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