Datasheet > SICB0860P

SICB0860P

更新时间： 2024-11-03 14:54:47

品牌	Logo	应用领域
美微科 - MCC		/
页数	文件大小	规格书
5页	1543K
描述
Tape&Reel: 800pcs/Reel;

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中文翻译

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数据手册

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SICB0860P 数据手册

SICB0860P

Features

•

Zero Reverse Recovery Current

8Amp

•

Positive Temperature Coefficient

High-Speed Switching

Silicon Carbide

Schottky Barrier

Rectifier

Moisture Sensitivity Level 1

Epoxy Meets UL 94 V-0 Flammability Rating

Halogen Free. “Green” Device (Note 1)

•

Lead Free Finish/RoHS Compliant(Note 2) ("P" Suffix designates

RoHS Compliant. See ordering information)

650 Volts

Benefits

•

Temperature-Independent Performance

Low Switching Loss

D²-PAK

Low Heat Dissipation Requirements

Applications

•

Switching Power Supply

Power Factor Correction

Motor Drive, Traction

Charging Pile

Maximum Ratings

•

Operating Junction Temperature Range: -55°C to +175°C

Storage Temperature Range: -55°C to +175°C

Typical Thermal Resistance: 1.1°C/W Junction to Case

MCC

Part Number

Device Marking

SICB0860P

DIMENSIONS

MIN MAX MIN MAX

0.331 0.370 8.40 9.40

0.378 0.417 9.60 10.60

0.165 0.189 4.20 4.80

0.027 0.037 0.68 0.94

0.045 0.055 1.14 1.40

INCHES

SICB0860P

DIM

NOTE

TYP.

Peak Repetitive Reverse

Voltage

V_RRM

650V

Surge Peak Reverse Voltage V_RSM

0.10

2.54

0.096 0.134 2.43 3.40

0.011 0.025 0.28 0.64

0.071 0.131 1.80 3.32

0.575 0.625 14.60 15.87

0.042 0.058 1.07 1.47

0.000 0.010 0.00 0.25

DC Reverse Voltage

V_DC

I_F

I_FSM

T_c=158°C

Average Forward Current

T_C=25°C, t_p=10ms,

Half Sine Pulse

Non-repetitive

Peak Forward Surge Current

70A

Suggested Solder Pad Layout

Unit:mm

T_C=25°C

Power Dissipation

P_D

136W

10.26

Note:

1.78

1. Halogen free "Green” products are defined as those which contain <900ppm bromine,

<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

2. High Temperature Solder Exemptions Applied, see EU Directive Annex 7a.

3.50

10.66

5.08

Internal Structure:

8.38

PIN 1,2,4

CASE

PIN 3

Rev.3-2-01292023

1/5

MCCSEMI.COM

12 3 4 5

中文翻译

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