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Si8819EDB PDF预览

Si8819EDB

更新时间: 2024-11-06 14:56:03
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 162K
描述
P-Channel 12 V (D-S) MOSFET

Si8819EDB 数据手册

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Si8819EDB  
Vishay Siliconix  
www.vishay.com  
P-Channel 12 V (D-S) MOSFET  
FEATURES  
• TrenchFET® power MOSFET  
MICRO FOOT® 0.8 x 0.8  
S
2
S
3
• Small 0.8 mm x 0.8 mm outline area  
• Low 0.4 mm max. profile  
xxx  
xx  
• Typical ESD protection 1700 V HBM  
1
G
• Material categorization:  
for definitions of compliance please see  
www.vishay.com/doc?99912  
4
D
1
Backside View  
Bump Side View  
Marking code: xx = AK  
APPLICATIONS  
S
xxx = Date / lot traceability code  
• Load switches and battery switches  
• High speed switching  
PRODUCT SUMMARY  
VDS (V)  
-12  
0.080  
0.100  
0.190  
0.280  
7
• For smart phones, tablet PCs, and  
mobile computing  
G
RDS(on) max. () at VGS = -3.7 V  
RDS(on) max. () at VGS = -2.5 V  
RDS(on) max. () at VGS = -1.8 V  
RDS(on) max. () at VGS = -1.5 V  
Qg typ. (nC)  
D (A) a, e  
D
I
-2.9  
P-Channel MOSFET  
Configuration  
Single  
ORDERING INFORMATION  
Package  
MICRO FOOT  
Lead (Pb)-free and halogen-free  
Si8819EDB-T2-E1  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
Parameter  
Symbol  
Limit  
-12  
Unit  
Drain-source voltage  
Gate-source voltage  
VDS  
V
VGS  
8
TA = 25 °C  
TA = 70 °C  
TA = 25 °C  
TA = 70 °C  
-2.9 a  
-2.3 a  
-2.1 b  
-1.7 b  
-15  
-0.7 a  
-0.4 b  
0.9 a  
Continuous drain current (TJ = 150 °C)  
ID  
A
Pulsed drain current (t = 100 μs)  
IDM  
IS  
TC = 25 °C  
Continuous source-drain diode current  
TA = 25 °C  
TA = 25 °C  
TA = 70 °C  
TA = 25 °C  
TA = 70 °C  
0.6 a  
Maximum power dissipation  
PD  
W
0.5 b  
0.3 b  
-55 to +150  
260  
Operating junction and storage temperature range  
Package reflow conditions c  
TJ, Tstg  
VPR  
°C  
IR/Convection  
260  
Notes  
a. Surface mounted on 1" x 1" FR4 board with full copper, t = 5 s  
b. Surface mounted on 1" x 1" FR4 board with minimum copper, t = 5 s  
c. Refer to IPC/JEDEC® (J-STD-020), no manual or hand soldering  
d. In this document, any reference to case represents the body of the MICRO FOOT device and foot is the bump  
e. Based on TA = 25 °C  
S15-0346-Rev. B, 23-Feb-15  
Document Number: 62963  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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