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SI7682DP PDF预览

SI7682DP

更新时间: 2024-09-16 01:25:07
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
7页 99K
描述
N-Channel 30-V (D-S) MOSFET

SI7682DP 数据手册

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Si7682DP  
Vishay Siliconix  
N-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)a  
20  
Available  
0.0090 at VGS = 10 V  
0.0130 at VGS = 4.5 V  
TrenchFET® Power MOSFET  
100 % Rg Tested  
30  
11 nC  
20  
APPLICATIONS  
PowerPAK SO-8  
High-Side DC/DC Conversion  
- Notebook  
- Server  
S
6.15 mm  
5.15 mm  
1
D
S
2
S
3
G
4
D
8
D
G
7
D
6
D
5
Bottom View  
Ordering Information: Si7682DP-T1-E3 (Lead (Pb)-free)  
S
N-Channel MOSFET  
Si7682DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
30  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
20  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
20  
15.5  
17.5b, c  
Continuous Drain Current (TJ = 150 °C)  
ID  
14.0b, c  
50  
TA = 70 °C  
A
Pulsed Drain Current  
IDM  
IS  
TC = 25 °C  
TA = 25 °C  
TC = 25 °C  
TC = 70 °C  
20  
4.5b, c  
27.5  
Continuous Source-Drain Diode Current  
17.5  
5b, c  
3.2b, c  
PD  
Maximum Power Dissipation  
W
TA = 25 °C  
TA = 70 °C  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
TJ, Tstg  
- 55 to 150  
°C  
260  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
Typical  
Maximum  
Unit  
t 10 s  
Steady State  
20  
25  
°C/W  
RthJC  
3.5  
4.5  
Notes:  
a. Based on TC = 25 °C.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 70 °C/W.  
Document Number: 73350  
S09-0272-Rev. B, 16-Feb-09  
www.vishay.com  
1

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