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Si7322DN PDF预览

Si7322DN

更新时间: 2024-11-29 14:54:55
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
13页 599K
描述
N-Channel 100 V (D-S) MOSFET

Si7322DN 数据手册

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Si7322DN  
Vishay Siliconix  
www.vishay.com  
N-Channel 100-V (D-S) MOSFET  
FEATURES  
• TrenchFET® power MOSFET  
PowerPAK® 1212-8 Single  
D
D
7
8
D
6
• 100 % UIS tested  
D
5
• Material categorization:  
for definitions of compliance please see  
www.vishay.com/doc?99912  
Available  
1
S
APPLICATIONS  
2
S
D
3
• Primary switch  
4
G
S
1
• Isolated DC/DC converters  
Top View  
Bottom View  
PRODUCT SUMMARY  
VDS (V)  
RDS(on) max. () at VGS = 10 V  
Qg typ. (nC)  
ID (A) a  
G
100  
0.058  
13  
S
18  
N-Channel MOSFET  
Configuration  
Single  
ORDERING INFORMATION  
Package  
Lead (Pb)-free  
Lead (Pb)-free and halogen-free  
PowerPAK 1212-8  
Si7322DN-T1-E3  
Si7322DN-T1-GE3  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
Drain-source voltage  
Gate-source voltage  
SYMBOL  
LIMIT  
100  
UNIT  
VDS  
VGS  
V
20  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
18 a  
16 a  
Continuous drain current (TJ = 150 °C)  
ID  
5.5 b, c  
4.4 b, c  
20  
A
Pulsed drain current  
IDM  
IS  
TC = 25 °C  
18 a  
3.2 b, c  
19  
18  
52  
Continuous source-drain diode current  
TA = 25 °C  
L = 0.1 mH  
TC = 25 °C  
Single pulse avalanche current  
Single pulse avalanche energy  
IAS  
EAS  
mJ  
W
TC = 70 °C  
33  
Maximum power dissipation  
PD  
TA = 25 °C  
TA = 70 °C  
3.8 b, c  
2.4 b, c  
-55 to +150  
260  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d, e  
TJ, Tstg  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum junction-to-ambient b, f  
Maximum junction-to-case (drain)  
SYMBOL  
TYPICAL  
26  
MAXIMUM  
UNIT  
t 10 s  
Steady state  
RthJA  
RthJC  
33  
2.4  
°C/W  
1.9  
Notes  
a. Package limited  
b. Surface mounted on 1" x 1" FR4 board  
c. t = 10 s  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
f. Maximum under steady state conditions is 81 °C/W  
S-81549-Rev. B, 07-Jul-08  
Document Number: 69638  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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