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SI7315DN PDF预览

SI7315DN

更新时间: 2024-11-29 01:26:31
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
13页 571K
描述
P-Channel 150 V (D-S) MOSFET

SI7315DN 数据手册

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Si7315DN  
Vishay Siliconix  
P-Channel 150 V (D-S) MOSFET  
FEATURES  
TrenchFET® Power MOSFET  
PRODUCT SUMMARY  
Low Thermal Resistance PowerPAK®  
Package with Small Size  
ID (A)e  
VDS (V)  
RDS(on) () Max.  
Qg (Typ.)  
0.315 at VGS = - 10 V  
0.350 at VGS = - 6 V  
- 8.9  
- 8.7  
100 % Rg and UIS Tested  
Material categorization:  
- 150  
15.4 nC  
Available  
For definitions of compliance please see  
www.vishay.com/doc?99912  
PowerPAK 1212-8  
APPLICATIONS  
S
Active Clamp in Intermediate DC/DC  
Power Supplies  
S
3.3 mm  
3.3 mm  
1
S
2
S
H-Bridge High Side Switch for Lighting  
Application  
3
G
G
4
D
Load Switch  
8
D
7
D
6
D
5
D
Bottom View  
Ordering Information:  
Si7315DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
VDS  
Limit  
- 150  
30  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
T
C = 25 °C  
TC = 70 °C  
A = 25 °C  
TA = 70 °C  
- 8.9  
- 7.1  
Continuous Drain Current (TJ = 150 °C)  
ID  
- 2.4a, b  
- 1.9a, b  
- 10  
- 18f  
- 3.2a, b  
T
A
IDM  
IS  
Pulsed Drain Current (t = 100 µs)  
TC = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
IAS  
14  
Avalanche Current  
Single-Pulse Avalanche Energy  
L = 0.1 mH  
EAS  
9.8  
mJ  
W
T
T
T
C = 25 °C  
C = 70 °C  
A = 25 °C  
52  
33  
PD  
Maximum Power Dissipation  
3.8a, b  
2.4a, b  
- 50 to 150  
260  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)c, d  
°C  
Notes:  
a. Surface mounted on 1" x 1" FR4 board.  
b. t = 10 s.  
c. See solder profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
e. Based on TC = 25 °C.  
f. Package limited.  
Document Number: 62895  
S13-1816-Rev. A, 12-Aug-13  
For technical questions, contact: pmostechsupport@vishay.com  
This document is subject to change without notice.  
www.vishay.com  
1
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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