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SI7232DN PDF预览

SI7232DN

更新时间: 2024-11-25 09:25:55
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威世 - VISHAY /
页数 文件大小 规格书
13页 590K
描述
Dual N-Channel 20-V (D-S) MOSFET

SI7232DN 数据手册

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New Product  
Si7232DN  
Vishay Siliconix  
Dual N-Channel 20-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
Qg (Typ.)  
Definition  
25f  
TrenchFET® Power MOSFET  
Compliant to RoHS Directive 2002/95/EC  
0.0164 at VGS = 4.5 V  
0.020 at VGS = 2.5 V  
0.024 at VGS = 1.8 V  
25f  
20  
12 nC  
24.6  
APPLICATIONS  
DC/DC  
Notebook System Power  
POL  
PowerPAK® 1212-8  
D
1
D
2
S1  
3.30 mm  
3.30 mm  
1
G1  
2
S2  
3
G2  
4
D1  
G
1
G
2
8
D1  
7
D2  
6
D2  
5
S
S
2
1
Bottom View  
Ordering Information: Si7232DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
20  
8
V
25f  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
23.8  
10a, b  
8a, b  
40  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
Pulsed Drain Current  
IDM  
IS  
T
C = 25 °C  
19  
Continuous Source-Drain Diode Current  
2.2a, b  
15  
TA = 25 °C  
L = 0.1 mH  
TC = 25 °C  
IAS  
EAS  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
mJ  
W
11  
23  
T
C = 70 °C  
14.8  
2.6a, b  
1.7a, b  
- 55 to 150  
260  
Maximum Power Dissipation  
PD  
TA = 25 °C  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)c, d  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
RthJC  
Typical  
38  
Maximum  
Unit  
Maximum Junction-to-Ambienta, e  
Maximum Junction-to-Case (Drain)  
t 10 s  
Steady State  
48  
°C/W  
4.3  
5.4  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. t = 10 s.  
c. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
d. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
e. Maximum under steady state conditions is 94 °C/W.  
f. Package Limited.  
Document Number: 68986  
S09-1499-Rev. B, 10-Aug-09  
www.vishay.com  
1

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