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SI7224DN

更新时间: 2024-11-28 09:25:55
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
18页 606K
描述
Dual N-Channel 30-V (D-S) MOSFET

SI7224DN 数据手册

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New Product  
Si7224DN  
Vishay Siliconix  
Dual N-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free Option Available  
TrenchFET® Power MOSFETs  
VDS (V)  
RDS(on) (Ω)  
ID (A) Qg (Typ.)  
6a  
6a  
0.035 at VGS = 10 V  
0.042 at VGS = 4.5 V  
0.028 at VGS = 10 V  
0.035 at VGS = 4.5 V  
Channel 1  
Channel 2  
30  
4.5 nC  
RoHS  
COMPLIANT  
APPLICATIONS  
6a  
6a  
Notebook PC System Power  
30  
5.5 nC  
Low Current POL  
PowerPAK® 1212-8  
D
1
D
2
S1  
3.30 mm  
3.30 mm  
1
G1  
2
S2  
3
G2  
4
D1  
G
1
G
2
8
D1  
7
D2  
Bottom View  
6
D2  
5
S
1
S
2
Ordering Information: Si7224DN-T1-E3 (Lead (Pb)-free)  
Si7224DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Channel 1  
Channel 2  
Unit  
VDS  
30  
16  
6a  
6a  
6a, b, c  
5.2b, c  
25  
30  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
20  
6a  
6a  
6a, b, c  
5.9b, c  
30  
6a  
2.2b, c  
T
C = 25 °C  
C = 70 °C  
T
ID  
Continuous Drain Current (TJ = 150 °C)  
TA = 25 °C  
TA = 70 °C  
A
IDM  
IS  
Pulsed Drain Current  
6a  
1.7b, c  
TC = 25 °C  
TA = 25 °C  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
Source Drain Current Diode Current  
17.8  
23  
11.4  
14.8  
PD  
Maximum Power Dissipation  
W
2.5b, c  
1.6b, c  
2.6b, c  
1.7b, c  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Channel 1  
Typ. Max.  
40 50  
5.6  
Channel 2  
Typ. Max.  
38 48  
4.3 5.4  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
Unit  
t 10 s  
°C/W  
RthJC  
Steady State  
7
Notes:  
a. Package limited.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequade bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 94 °C/W.  
Document Number: 69500  
S-81549-Rev. B, 07-Jul-08  
www.vishay.com  
1

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