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SI7220DN_08 PDF预览

SI7220DN_08

更新时间: 2024-11-28 11:57:31
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
12页 564K
描述
Dual N-Channel 60-V (D-S) MOSFET

SI7220DN_08 数据手册

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Si7220DN  
Vishay Siliconix  
Dual N-Channel 60-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
4.8  
Qg (Typ.)  
Available  
0.060 at VGS = 10 V  
0.075 at VGS = 4.5 V  
TrenchFET® Power MOSFET  
60  
13  
New Low Thermal Resistance PowerPAK®  
4.3  
1
Package,  
/
the Space of An SO-8 While  
3
Thermally Comparable  
APPLICATIONS  
Synchronous Rectification  
Primary Side Switch  
PowerPAK 1212-8  
S1  
D
1
D
2
3.30 mm  
3.30 mm  
1
G1  
2
S2  
3
G2  
4
D1  
8
D1  
G
1
G
2
7
D2  
6
D2  
5
Bottom View  
S
S
2
1
Ordering Information: Si7220DN-T1-E3 (Lead (Pb)-free)  
Si7220DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
10 s  
Steady State  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
60  
20  
V
VGS  
TA = 25 °C  
TA = 70 °C  
4.8  
3.8  
3.4  
2.7  
20  
Continuous Drain Current (TJ = 150 °C)a  
ID  
A
IDM  
IAS  
EAS  
IS  
Pulsed Drain Current  
Avalanche Current  
11  
L = 0 1 mH  
Single Avalanche Energy  
6.1  
1.1  
1.3  
0.69  
mJ  
A
Continuous Source Current (Diode Conduction)a  
2.2  
2.6  
1.4  
TA = 25 °C  
TA = 70 °C  
Maximum Power Dissipationa  
PD  
W
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b, c  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
38  
Maximum  
Unit  
t 10 s  
48  
94  
Maximum Junction-to-Ambienta  
RthJA  
Steady State  
Steady State  
77  
°C/W  
RthJC  
Maximum Junction-to-Case (Drain)  
4.3  
5.4  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 73117  
S-83052-Rev. C, 29-Dec-08  
www.vishay.com  
1

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