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SI7216DN

更新时间: 2024-11-28 09:25:55
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
14页 575K
描述
Dual N-Channel 40-V (D-S) MOSFET

SI7216DN 数据手册

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Si7216DN  
Vishay Siliconix  
Dual N-Channel 40-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) ()  
ID (A)  
Qg (Typ.)  
Available  
TrenchFET® Power MOSFET  
6e  
5e  
0.032 at VGS = 10 V  
0.039 at VGS = 4.5 V  
Low Thermal Resistance PowerPAK®  
Package with Small Size and Low 1.07 mm  
Profile  
40  
5.5 nC  
100 % Rg and UIS tested  
Compliant to RoHS Directive 2002/95/EC  
APPLICATIONS  
Primary Side Switch  
Synchronus Rectification  
PowerPAK 1212-8  
D
1
D
2
S1  
3.30 mm  
3.30 mm  
1
G1  
2
S2  
3
G2  
4
D1  
G
1
G
2
8
D1  
7
D2  
Bottom View  
6
D2  
5
S
S
2
1
Ordering Information: Si7216DN-T1-E3 (Lead (Pb)-free)  
Si7216DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
40  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
20  
6e  
5e  
6.5a, b  
5.2a, b  
20  
6e  
2a, b  
T
C = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
ID  
Continuous Drain Current (TJ = 150 °C)  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
TA = 25 °C  
Continuous Source-Drain Diode Current  
IAS  
Avalanche Current  
10  
L = 0.1 mH  
EAS  
Single-Pulse Avalanche Energy  
5
mJ  
W
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
20.8  
13.3  
PD  
Maximum Power Dissipation  
2.5a, b  
1.6a, b  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)c, d  
- 50 to 150  
°C  
260  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. t = 10 s.  
c. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequade bottom side solder interconnection.  
d. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
e. Package limited.  
Document Number: 73771  
S11-1142-Rev. C, 13-Jun-11  
www.vishay.com  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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