Datasheet > Si7135DP

Si7135DP

更新时间： 2024-09-18 14:55:59

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
13页	358K
描述
P-Channel 30 V (D-S) MOSFET

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Si7135DP 数据手册

Si7135DP

Vishay Siliconix

www.vishay.com

P-Channel 30 V (D-S) MOSFET

FEATURES

• TrenchFET^®power MOSFET

PowerPAK^®SO-8 Single

• 100 % R_gtested

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

APPLICATIONS

• Notebook

- Load switch

Top View

Bottom View

PRODUCT SUMMARY

V_DS(V)

-30

0.0039

0.0062

_DS(on)max. () at V_GS= -10 V

_DS(on)max. () at V_GS= -4.5 V

Q_gtyp. (nC)

_D(A) ^a

Configuration

P-Channel MOSFET

-60

Single

ORDERING INFORMATION

Package

PowerPAK SO-8

Lead (Pb)-free and halogen-free

Si7135DP-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

-30

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

-60 ^a

Continuous drain current (T_J= 150 °C)

I_D

-31.6 ^{b, c}

-25.3 ^{b, c}

-100

Pulsed drain current

I_DM

I_S

_C= 25 °C

-60 ^a

-5.6 ^{b, c}

-40

104

66.6

6.25 ^{b, c}

4 ^{b, c}

Continuous source-drain diode current

T_A= 25 °C

L = 0.1 mH

T_C= 25 °C

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

_C= 70 °C

_A= 25 °C

Maximum power dissipation

P_D

T_A= 70 °C

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^{d, e}

T_J, T_stg

-55 to +150

260

°C

THERMAL RESISTANCE RATINGS

PARAMETER

SYMBOL

R_thJA

TYPICAL

MAXIMUM

UNIT

Maximum junction-to-ambient ^{b, f}

t 10 s

Steady state

°C/W

Maximum junction-to-case (drain)

R_thJC

0.9

1.2

Notes

a. Package limited

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is

exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip

cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 54 °C/W

S-81588-Rev. A, 07-Jul-08

Document Number: 68807

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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