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SI7123DN-T1-GE3 PDF预览

SI7123DN-T1-GE3

更新时间: 2024-11-20 22:58:39
品牌 Logo 应用领域
威世 - VISHAY 开关脉冲晶体管
页数 文件大小 规格书
13页 571K
描述
MOSFET P-CH 20V 10.2A 1212-8

SI7123DN-T1-GE3 技术参数

是否无铅: 不含铅生命周期:Obsolete
包装说明:SMALL OUTLINE, S-XDSO-C5针数:8
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.8雪崩能效等级(Eas):31 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (Abs) (ID):25 A
最大漏极电流 (ID):10.2 A最大漏源导通电阻:0.0106 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:S-XDSO-C5
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):52 W
最大脉冲漏极电流 (IDM):40 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:C BEND
端子位置:DUAL处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SI7123DN-T1-GE3 数据手册

 浏览型号SI7123DN-T1-GE3的Datasheet PDF文件第2页浏览型号SI7123DN-T1-GE3的Datasheet PDF文件第3页浏览型号SI7123DN-T1-GE3的Datasheet PDF文件第4页浏览型号SI7123DN-T1-GE3的Datasheet PDF文件第5页浏览型号SI7123DN-T1-GE3的Datasheet PDF文件第6页浏览型号SI7123DN-T1-GE3的Datasheet PDF文件第7页 
New Product  
Si7123DN  
Vishay Siliconix  
P-Channel 20 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
Definition  
TrenchFET® Power MOSFET: 1.8 V Rated  
Ultra Low On-Resistance for Increased  
Battery Life  
0.0106 at VGS = - 4.5 V  
0.0136 at VGS = - 2.5 V  
0.0189 at VGS = - 1.8 V  
- 16.0  
- 14.1  
- 12.0  
- 20  
New PowerPAK® Package  
- Low Thermal Resistance, RthJC  
- Low 1.07 mm Profile  
Compliant to RoHS Directive 2002/95/EC  
PowerPAK 1212-8  
APPLICATIONS  
Load/Power Switching in Portable Devices  
S
3.30 mm  
3.30 mm  
1
S
S
2
S
3
G
4
D
G
8
D
7
D
6
D
5
Bottom View  
D
Ordering Information: Si7123DN-T1-E3 (Lead (Pb)-free)  
Si7123DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
10 s  
Steady State  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
- 20  
8
V
VGS  
TA = 25 °C  
TA = 70 °C  
- 16.0  
- 12.8  
- 10.2  
- 8.2  
Continuous Drain Current (TJ = 150 °C)a  
ID  
A
IDM  
IS  
Pulsed Drain Current  
- 40  
Continuous Source Current (Diode Conduction)a  
- 3.2  
3.8  
- 1.3  
1.5  
TA = 25 °C  
TA = 70 °C  
Maximum Power Dissipationa  
PD  
W
2.4  
1.0  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b, c  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
26  
Maximum  
Unit  
t 10 s  
33  
81  
Maximum Junction-to-Ambienta  
Maximum Junction-to-Case  
RthJA  
Steady State  
Steady State  
65  
°C/W  
RthJC  
1.9  
2.4  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 69655  
S10-0347-Rev. D, 15-Feb-10  
www.vishay.com  
1

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