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SI7121DN PDF预览

SI7121DN

更新时间: 2024-11-07 12:46:59
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
13页 552K
描述
P-Channel 30-V (D-S) MOSFET

SI7121DN 数据手册

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New Product  
Si7121DN  
Vishay Siliconix  
P-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
Qg (Typ.)  
TrenchFET® Power MOSFET  
100% Rg Tested  
- 16d  
- 16d  
0.018 at VGS = - 10 V  
0.0305 at VGS = - 4.5 V  
RoHS  
- 30  
22 nC  
COMPLIANT  
100% UIS Tested  
APPLICATIONS  
PowerPAK® 1212-8  
Notebook Battery Charging  
Notebook Adapter Switch  
S
S
3.30 mm  
3.30 mm  
1
S
2
S
3
G
4
G
D
8
D
7
D
6
D
5
D
Bottom View  
Ordering Information: Si7121DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
VDS  
Limit  
- 30  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
25  
- 16d  
- 16d  
- 10.6a, b  
- 8.6a, b  
- 50  
- 16d  
- 3.0a, b  
- 20  
T
C = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
IAS  
Avalanche Current  
L = 0.1 mH  
EAS  
Single-Pulse Avalanche Energy  
20  
mJ  
W
T
T
T
C = 25 °C  
C = 70 °C  
A = 25 °C  
52  
33  
PD  
Maximum Power Dissipation  
3.7a, b  
2.4a, b  
- 55 to 150  
260  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)e, f  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
RthJC  
Typical  
26  
Maximum  
Unit  
°C/W  
Maximum Junction-to-Ambienta, c  
t 10 s  
Steady State  
33  
Maximum Junction-to-Case  
1.9  
2.4  
Notes:  
a. Surface mounted on 1" x 1" FR4 board.  
b. t = 10 s.  
c. Maximum under Steady State conditions is 81 °C/W.  
d. Package limited.  
e. See Solder Profile (http://www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
f. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 69956  
S-81466-Rev. C, 23-Jun-08  
www.vishay.com  
1

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