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SI7120DN PDF预览

SI7120DN

更新时间: 2024-11-06 21:55:35
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
5页 68K
描述
N-Channel 60-V (D-S) MOSFET

SI7120DN 数据手册

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Si7120DN  
Vishay Siliconix  
N-Channel 60-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
D TrenchFETr Power MOSFET  
VDS (V)  
rDS(on) (W)  
ID (A)  
D New Low Thermal Resistance  
0.019 @ V = 10 V  
10  
D PowerPAKr 1212-8 Package with  
GS  
RoHS  
COMPLIANT  
Available  
60  
Low 1.07-mm Profile  
0.028 @ V = 4.5 V  
GS  
8.2  
D 100% Rg Tested  
APPLICATIONS  
D Primary Side Switch  
PowerPAK 1212-8  
D Synchronous Rectification  
D
S
3.30 mm  
3.30 mm  
1
S
2
S
3
G
4
G
D
8
D
7
D
Ordering Information: Si7120DN-T1  
Si7120DN-T1—E3 (Lead (Pb)-Free)  
6
D
5
S
N-Channel MOSFET  
Bottom View  
ABSOLUTE MAXIMUM RATINGS (T = 25_C UNLESS OTHERWISE NOTED)  
A
Parameter  
Symbol  
10 secs  
Steady State  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
V
60  
DS  
GS  
V
V
"20  
T
= 25_C  
= 70_C  
10  
6.3  
5.1  
A
a
Continuous Drain Current (T = 150_C)  
I
J
D
T
A
8.0  
A
Pulsed Drain Current  
I
40  
DM  
a
Continuous Source Current (Diode Conduction)  
Single Avalanche Current  
I
3.2  
1.3  
S
I
AS  
22  
24  
L = 0.1 mH  
Single Avalanche Energy  
E
AS  
mJ  
W
T
= 25_C  
= 70_C  
3.8  
2.4  
1.5  
1.0  
A
a
Maximum Power Dissipation  
P
D
T
A
Operating Junction and Storage Temperature Range  
T , T  
55 to 150  
J
stg  
_C  
b,c  
Soldering Recommendations (Peak Temperature)  
260  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
Maximum  
Unit  
t v 10 sec  
Steady State  
Steady State  
26  
65  
33  
81  
a
Maximum Junction-to-Ambient  
R
R
thJA  
_C/W  
Maximum Junction-to-Case (Drain)  
1.9  
2.4  
thJC  
Notes  
a. Surface Mounted on 1” x 1” FR4 Board.  
b. See Solder Profile (http://www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed copper (not  
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure  
adequate bottom side solder interconnection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 72771  
S-51128—Rev. D, 13-Jun-05  
www.vishay.com  
1

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