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SI4467DYS62Z PDF预览

SI4467DYS62Z

更新时间: 2024-11-20 15:51:11
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 开关脉冲光电二极管晶体管
页数 文件大小 规格书
5页 90K
描述
Power Field-Effect Transistor, 13.5A I(D), 20V, 0.0085ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, SO-8

SI4467DYS62Z 技术参数

生命周期:Obsolete零件包装代码:SOT
包装说明:SMALL OUTLINE, R-PDSO-G8针数:8
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.7配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (ID):13.5 A
最大漏源导通电阻:0.0085 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-G8元件数量:1
端子数量:8工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:P-CHANNEL
最大脉冲漏极电流 (IDM):50 A认证状态:Not Qualified
表面贴装:YES端子形式:GULL WING
端子位置:DUAL晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SI4467DYS62Z 数据手册

 浏览型号SI4467DYS62Z的Datasheet PDF文件第2页浏览型号SI4467DYS62Z的Datasheet PDF文件第3页浏览型号SI4467DYS62Z的Datasheet PDF文件第4页浏览型号SI4467DYS62Z的Datasheet PDF文件第5页 
January 2001  
Si4467DY  
P-Channel 1.8V Specified PowerTrench MOSFET  
General Description  
Features  
This P-Channel 1.8V specified MOSFET is a rugged  
gate version of Fairchild Semiconductor’s advanced  
PowerTrench process. It has been optimized for power  
management applications with a wide range of gate  
drive voltage (1.8V – 8V).  
–13.5 A, –20 V. RDS(ON) = 8.5 m@ VGS = –4.5 V  
DS(ON) = 10.5 m@ VGS = –2.5 V  
RDS(ON) = 14 m@ VGS = –1.8 V  
R
Fast switching speed  
Applications  
High performance trench technology for extremely  
Power management  
Load switch  
low RDS(ON)  
High current and power handling capability  
Battery protection  
D
5
6
7
8
4
3
2
1
D
D
D
G
SO-8  
S
S
S
Pin 1  
Absolute Maximum Ratings TA=25oC unless otherwise noted  
Symbol  
VDSS  
Parameter  
Drain-Source Voltage  
Ratings  
20  
Units  
V
V
A
VGSS  
Gate-Source Voltage  
±8  
ID  
Drain Current – Continuous  
– Pulsed  
(Note 1a)  
13.5  
50  
Power Dissipation for Single Operation  
(Note 1a)  
(Note 1b)  
(Note 1c)  
2.5  
PD  
W
1.5  
1.2  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +175  
°C  
Thermal Characteristics  
Thermal Resistance, Junction-to-Ambient  
(Note 1a)  
(Note 1c)  
(Note 1)  
50  
125  
25  
RθJA  
RθJA  
RθJC  
°C/W  
°C/W  
°C/W  
Thermal Resistance, Junction-to-Ambient  
Thermal Resistance, Junction-to-Case  
Package Marking and Ordering Information  
Device Marking  
Device  
Reel Size  
Tape width  
Quantity  
4467  
Si4467DY  
13’’  
12mm  
2500 units  
Si4467DY Rev A  
2001 Fairchild Semiconductor International  

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