Datasheet > Si4459BDY

Si4459BDY

更新时间： 2024-11-21 14:53:59

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威世 - VISHAY		/
页数	文件大小	规格书
9页	233K
描述
P-Channel 30 V (D-S) MOSFET

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Si4459BDY 数据手册

Si4459BDY

Vishay Siliconix

www.vishay.com

P-Channel 30 V (D-S) MOSFET

FEATURES

• TrenchFET^®Gen IV p-channel power MOSFET

SO-8 Single

• Enables higher power density

• 100 % R_gand UIS tested

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

APPLICATIONS

• Battery management in mobile devices

• Adapter and charger switch

Top View

PRODUCT SUMMARY

• Battery switch

V_DS(V)

-30

0.0049

0.0082

• Load switch

_DS(on)max. () at V_GS= 10 V

_DS(on)max. () at V_GS= 4.5 V

Q_gtyp. (nC)

_D(A)

P-Channel MOSFET

27.8 ^{a, g}

Configuration

Single

ORDERING INFORMATION

Package

SO-8

Lead (Pb)-free and halogen-free

Si4459BDY-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

-30

+16 / -20

-27.8

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

-22.1

Continuous drain current (T_J= 150 °C)

I_D

-20.5 ^{b, c}

-16.4 ^{b, c}

-150

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

T_A= 25 °C

-5

-2.8 ^{b, c}

Continuous source-drain diode current

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

-25

31.2

5.6

3.6

3.1 ^{b, c}

2 ^{b, c}

L = 0.1 mH

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Maximum power dissipation

I_P

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^c

T_J, T_stg

-55 to +150

260

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^b

SYMBOL

R_thJA

R_thJF

TYPICAL

MAXIMUM

UNIT

t  10 s

Steady state

°C/W

Maximum junction-to-case (drain)

Notes

a. Package limited

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The SO-8 is a leadless package. The end of the lead terminal is exposed copper (not

plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not

required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 85 °C/W

g. T_C= 25 °C

S17-1507-Rev. A, 02-Oct-17

Document Number: 76759

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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