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SI3139KL3C PDF预览

SI3139KL3C

更新时间: 2024-11-19 17:01:11
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
6页 2495K
描述
Tape&Reel: 10Kpcs/Reel;

SI3139KL3C 数据手册

 浏览型号SI3139KL3C的Datasheet PDF文件第2页浏览型号SI3139KL3C的Datasheet PDF文件第3页浏览型号SI3139KL3C的Datasheet PDF文件第4页浏览型号SI3139KL3C的Datasheet PDF文件第5页浏览型号SI3139KL3C的Datasheet PDF文件第6页 
SI3139KL3C  
Features  
Trench LV MOSFET Technology  
ESD Protected Up To 2KV(HBM)  
• Moisture Sensitivity Level 1  
• Halogen Free. “Green” Device (Note 1)  
P-Channel MOSFET  
• Epoxy Meets UL 94 V-0 Flammability Rating  
• Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS  
Compliant. See Ordering Information)  
Maximum Ratings  
Operating Junction Temperature Range: -55°C to +150°C  
Storage Temperature Range: -55°C to +150°C  
Maximum Thermal Resistance: 140°C/W Junction to Ambient(Note2)  
DFN1006-3A  
Parameter  
Drain-Source Voltage  
Rating  
-20  
Unit  
V
Symbol  
VDS  
D
A
1
Gate-Source Voltage  
VGS  
±12  
V
E
Ta=25°C  
-0.5  
-0.3  
2
A1  
ID  
A
Drain Current-Continuous  
3
Ta=100°C  
e
L1  
Pulsed Drain Current(Note3)  
IDM  
PD  
-2  
A
b1  
1
Power Dissipation(Note4)  
0.9  
W
b
E1  
2
1RWHꢀ  
3
L
L1  
L
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DIMENSIONS  
MM  
MIN MAX MIN MAX  
0.013 0.016 0.34 0.40  
INCHES  
DIM  
A
NOTE  
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A1 0.000 0.002 0.00 0.05  
0.018 0.022 0.45 0.55  
b1 0.004 0.008 0.10 0.20  
b
D
E
0.037 0.042 0.95 1.075  
0.022 0.026 0.55 0.675  
E1 0.006 0.010 0.15 0.25  
0.026  
0.008 0.012 0.20 0.30  
0.0002 0.05  
0.65  
TYP.  
TYP.  
e
L
L1  
Internal Structure and Marking Code  
D
Suggested Solder Pad Layout  
Pin1  
1. GATE  
2. SOURCE  
(mm)  
Pin3  
3C  
3. DRAIN  
0.50  
0.50  
G
Pin2  
0.25  
S
0.65  
0.20  
0.25  
Rev.4-1-08012023  
1/6  
MCCSEMI.COM  

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