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SI3139KL3B PDF预览

SI3139KL3B

更新时间: 2024-11-06 14:54:27
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
6页 1088K
描述
Tape&Reel: 10Kpcs/Reel;

SI3139KL3B 数据手册

 浏览型号SI3139KL3B的Datasheet PDF文件第2页浏览型号SI3139KL3B的Datasheet PDF文件第3页浏览型号SI3139KL3B的Datasheet PDF文件第4页浏览型号SI3139KL3B的Datasheet PDF文件第5页浏览型号SI3139KL3B的Datasheet PDF文件第6页 
SI3139KL3B  
P-Channel MOSFET  
DFN1006-3  
Features  
Operated at Low Logic Level Gate Drive  
P-Channel Switch with Low RDS(on)  
• Epoxy Meets UL 94 V-0 Flammability Rating  
ESD Protected up to 2KV(HBM)  
• Moisture Sensitivity Level 1  
Halogen Free. “Green” Device (Note 1)  
• Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS  
Compliant. See Ordering Information)  
Maximum Ratings  
• Operating Junction Temperature Range: -55°C to +150°C  
• Storage Temperature Range: -55°C to +150°C  
• Maximum Thermal Resistance: 381°C/W Junction to Ambient(Note 2)  
Parameter  
Drain-Source Voltage  
Rating  
-20  
Unit  
V
Symbol  
VDS  
D
A
1
Gate-Source Voltage  
VGS  
±12  
V
C
E
TA=25°C  
-0.65  
2
A1  
ID  
A
3
Drain Current-Continuous  
TA=100°C  
-0.41  
-2  
e
L1  
Pulsed Drain Current(Note 3)  
Power Dissipation(Note 4)  
Note:  
IDM  
PD  
A
b1  
1
328  
mW  
b
E1  
2
3
1. Halogen free "Green” products are defined as those which contain <900ppm bromine,  
L
L1  
L
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.  
DIMENSIONS  
MM  
MIN MAX MIN MAX  
2. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz.  
Copper, in a still air environment with TA =25°C. The Power dissipation PDSM is based  
on RθJA t10s and the maximum allowed junction temperature of 150°C. The value in  
any given application depends on the user's specific board design.  
INCHES  
DIM  
A
NOTE  
0.017 0.022 0.42 0.55  
A1 0.000 0.002 0.00 0.05  
0.018 0.022 0.45 0.55  
b1 0.004 0.008 0.10 0.20  
3. Repetitive rating; pulse width limited by max. junction temperature.  
b
4. PD is based on max. junction temperature, using junction-case thermal resistance.  
c
D
E
0.005 0.007 0.12 0.18  
0.037 0.041 0.95 1.05  
0.022 0.026 0.55 0.65  
E1 0.006 0.010 0.15 0.25  
Internal Structure and Marking Code  
0.026  
0.008 0.012 0.20 0.30  
0.0002 0.05  
0.65  
TYP.  
TYP.  
e
L
L1  
D
Pin1  
1. GATE  
2. SOURCE  
Suggested Solder Pad Layout  
Pin3  
9A  
3. DRAIN  
G
(mm)  
Pin2  
0.50  
0.50  
S
0.25  
0.65  
0.20  
0.25  
Rev.4-1-04172023  
1/6  
MCCSEMI.COM  

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