SI2305B
Features
• Excellent Stability and Uniformity
• High Dense Cell Design for Extremely Low RDS(ON)
• Epoxy Meets UL 94 V-0 Flammability Rating
• Moisture Sensitivity Level 1
Pꢀ&+$11(/
• Halogen Free. “Green” Device (1)
026)(7
• Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS
Compliant. See Ordering Information)
Maximum Ratings
•
•
Operating Junction Temperature Range : -55°C to +150°C
Storage Temperature Range: -55°C to +150°C
Thermal Resistance:90°C/W Junction to Ambient(Steady-State)(2)
SOT-23
•
A
D
Parameter
Rating
-20
Symbol
VDS
Unit
V
3
Drain-Source Voltage
Gate-Source Volltage
B
C
VGS
±10
V
1
2
F
E
-4.2
TA=25°C
Continuous Drain Current
A
ID
-2.7
-21
1.4
TA=100°C
H
G
J
Pulsed Drain Current(3)
IDM
PD
A
L
K
M
Total Power Dissipation(4)
W
DIMENSIONS
MM
INCHES
Note:
DIM
NOTE
MIN MAX MIN MAX
0.110 0.120 2.80 3.04
0.083 0.104 2.10 2.64
0.047 0.055 1.20 1.40
0.034 0.041 0.85 1.05
0.067 0.083 1.70 2.10
0.018 0.024 0.45 0.60
1. Halogen free "Green” products are defined as those which contain <900ppm bromine,
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
A
B
C
D
E
F
2. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz.
Copper, in a still air environment with TA =25°C. The Power dissipation PDSM is based on
RθJA tʇꢀ10s and the maximum allowed junction temperature of 150°C. The value in any
given application depends on the user's specific board design.
G
H
J
K
L
0.01 0.15
3. Repetitive rating; pulse width limited by max. junction temperature.
0.0004 0.006
0.035 0.043 0.90 1.10
0.003 0.007 0.08 0.18
0.012 0.020 0.30 0.51
4. PD is based on max. junction temperature, using junction to ambient thermal resistance.
0.020
0.007
0.022 REF
0.50
0.20
M
0.55 REF
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Suggested Solder Pad Layout
0.031
0.800
D
0.035
0.900
1. GATE
2. SOURCE
S5B.
3. DRAIN
0.079
2.000
inches
mm
G
S
0.037
0.950
0.037
0.950
Rev.4-2-03032023
1/6
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