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SI2305B PDF预览

SI2305B

更新时间: 2024-09-16 14:55:59
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
6页 826K
描述
Tape: 3K/Reel, 120K/Ctn.;

SI2305B 数据手册

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SI2305B  
Features  
Excellent Stability and Uniformity  
High Dense Cell Design for Extremely Low RDS(ON)  
• Epoxy Meets UL 94 V-0 Flammability Rating  
• Moisture Sensitivity Level 1  
Pꢀ&+$11(/  
• Halogen Free. “Green” Device (1)  
026)(7  
• Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS  
Compliant. See Ordering Information)  
Maximum Ratings  
Operating Junction Temperature Range : -55°C to +150°C  
Storage Temperature Range: -55°C to +150°C  
Thermal Resistance:90°C/W Junction to Ambient(Steady-State)(2)  
SOT-23  
A
D
Parameter  
Rating  
-20  
Symbol  
VDS  
Unit  
V
3
Drain-Source Voltage  
Gate-Source Volltage  
B
C
VGS  
±10  
V
1
2
F
E
-4.2  
TA=25°C  
Continuous Drain Current  
A
ID  
-2.7  
-21  
1.4  
TA=100°C  
H
G
J
Pulsed Drain Current(3)  
IDM  
PD  
A
L
K
M
Total Power Dissipation(4)  
W
DIMENSIONS  
MM  
INCHES  
Note:  
DIM  
NOTE  
MIN MAX MIN MAX  
0.110 0.120 2.80 3.04  
0.083 0.104 2.10 2.64  
0.047 0.055 1.20 1.40  
0.034 0.041 0.85 1.05  
0.067 0.083 1.70 2.10  
0.018 0.024 0.45 0.60  
1. Halogen free "Green” products are defined as those which contain <900ppm bromine,  
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.  
A
B
C
D
E
F
2. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz.  
Copper, in a still air environment with TA =25°C. The Power dissipation PDSM is based on  
RθJA tʇꢀ10s and the maximum allowed junction temperature of 150°C. The value in any  
given application depends on the user's specific board design.  
G
H
J
K
L
0.01 0.15  
3. Repetitive rating; pulse width limited by max. junction temperature.  
0.0004 0.006  
0.035 0.043 0.90 1.10  
0.003 0.007 0.08 0.18  
0.012 0.020 0.30 0.51  
4. PD is based on max. junction temperature, using junction to ambient thermal resistance.  
0.020  
0.007  
0.022 REF  
0.50  
0.20  
M
0.55 REF  
,QWHUQDOꢀ6WUXFWXUHꢀDQGꢀ0DUNLQJꢀ&RGH  
Suggested Solder Pad Layout  
0.031  
0.800  
D
0.035  
0.900  
1. GATE  
2. SOURCE  
S5B.  
3. DRAIN  
0.079  
2.000  
inches  
mm  
G
S
0.037  
0.950  
0.037  
0.950  
Rev.4-2-03032023  
1/6  
MCCSEMI.COM  

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