SG50N06T, SG50N06DT
Discrete IGBTs
Dim.
Millimeter
Min. Max. Min.
Inches
Max.
Dimensions TO-247AD
A
B
19.81 20.32 0.780 0.800
20.80 21.46 0.819 0.845
C
D
15.75 16.26 0.610 0.640
3.55 3.65 0.140 0.144
E
C
G
G=Gate, C=Collector,
C(TAB)
E=Emitter,TAB=Collector
E
F
4.32 5.49 0.170 0.216
5.4
6.2 0.212 0.244
G
H
1.65 2.13 0.065 0.084
-
4.5
-
0.177
J
1.0
1.4 0.040 0.055
K
10.8 11.0 0.426 0.433
L
M
4.7
0.4
5.3 0.185 0.209
0.8 0.016 0.031
SG50N06DT
SG50N06T
N
1.5 2.49 0.087 0.102
Symbol
Test Conditions
Maximum Ratings
Unit
VCES
VCGR
TJ=25oC to 150oC
600
600
V
TJ=25oC to 150oC; RGE=1 M ;
VGES
VGEM
Continuous
Transient
±20
±30
V
A
IC25
IC90
ICM
TC=25oC
75
50
200
TC=90oC
TC=25oC, 1 ms
VGE=15V; TVJ=125oC; RG=10
Clamped inductive load
ICM=100
@ 0.8 VCES
SSOA
(RBSOA)
A
PC
TC=25oC
300
W
-55...+150
150
-55...+150
TJ
TJM
Tstg
oC
oC
Maximum lead temperature for soldering
1.6 mm (0.062 in.) from case for 10s
300
Md
Mounting torque
1.13/10
6
Nm/Ib.in.
g
Weight
(T
Characteristic Values
min. typ. max.
J
=25o
C, unless otherwise specified)
Symbol
Test Conditions
Unit
BVCES
I
I
C
=250uA; VGE=0V
=250uA; VCE=VGE
600
2.5
V
V
V
GE(th)
C
5.0
200
1
I
CES
V
V
V
CE=0.8VCES
GE=0V;
;
TJ
J
=25o
=125o
C
uA
mA
nA
V
T
C
I
GES
CE=0V; VGE=±20V
=IC90; VGE=15
±100
2.5
V
CE(sat)
I
C