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SFF3810ETX PDF预览

SFF3810ETX

更新时间: 2024-11-05 20:42:39
品牌 Logo 应用领域
SSDI 开关晶体管
页数 文件大小 规格书
2页 145K
描述
Power Field-Effect Transistor, 60A I(D), 75V, 0.003ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, MILPACK III-4

SFF3810ETX 技术参数

生命周期:Active包装说明:CHIP CARRIER, R-XBCC-N4
针数:4Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.65
雪崩能效等级(Eas):3000 mJ外壳连接:ISOLATED
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:75 V
最大漏极电流 (ID):60 A最大漏源导通电阻:0.003 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-XBCC-N4
元件数量:1端子数量:4
工作模式:ENHANCEMENT MODE封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:CHIP CARRIER
极性/信道类型:N-CHANNEL认证状态:Not Qualified
参考标准:MIL-19500表面贴装:YES
端子形式:NO LEAD端子位置:BOTTOM
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SFF3810ETX 数据手册

 浏览型号SFF3810ETX的Datasheet PDF文件第2页 
SFF3810 Series  
Solid State Devices, Inc.  
14701 Firestone Blvd * La Mirada, Ca 90638  
Phone: (562) 404-4474 * Fax: (562) 404-1773  
ssdi@ssdi-power.com * www.ssdi-power.com  
350 AMP , 75 Volts, 2.5 m  
Avalanche Rated N-channel  
TrenchFET  
DESIGNER’S DATA SHEET  
Part Number / Ordering Information 1/  
SFF3810 ___ ___ ___  
Screening 2/  
__ = Not Screened  
TX = TX Level  
TXV = TXV Level  
S = S Level  
Features:  
Rugged poly-Si gate  
Lowest ON-resistance in the industry  
Avalanche rated  
Hermetically Sealed, Isolated Package  
Low Total Gate Charge  
Fast Switching  
Lead Option 3/  
__ = Straight Leads  
DB = Down Bend  
UB = Up Bend  
Package 3/ 4/  
TX, TXV, S-Level screening available  
Improved (RDS(ON) QG) figure of merit  
Q = TO-258 modified  
E = MILPACK III  
Maximum Ratings5/  
Symbol  
VDSS  
Value  
Units  
V
Drain - Source Voltage  
75  
+ 20  
+ 30  
continuous  
transient  
Gate – Source Voltage  
VGS  
ID1  
V
A
A
Max. Continuous Drain Current (package  
limited)  
60  
@ TC = 25ºC  
@ TC = 25ºC  
@ TC = 125ºC  
ID2  
ID3  
350  
150  
Max. Instantaneous Drain Current (Tj limited)  
Max. Avalanche current  
@ L= 0.1 mH  
@ L= 0.1 mH  
@ TC = 25ºC  
IAR  
EAS  
200  
3000  
A
mJ  
W
Single and Repetitive Avalanche Energy  
Total Power Dissipation  
600  
PD  
Operating & Storage Temperature  
-55 to 175  
ºC  
TOP & TSTG  
Maximum Thermal Resistance  
(Junction to Case)  
RθJC  
0.5  
ºC/W  
NOTES:  
MILPACK III (E)  
TO-258 modified (Q)  
*Pulse Test: Pulse Width = 300µsec, Duty Cycle = 2%.  
1/ For ordering information, price, and availability - contact  
factory.  
2/ Screening based on MIL-PRF-19500. Screening flows  
available on request.  
3/ For lead bending options / pinout configurations - contact  
factory.  
4/ Maximum current limited by package configuration  
5/ Unless otherwise specified, all electrical characteristics  
@25oC.  
NOTE: All specifications are subject to change without notification.  
SCD's for these devices should be reviewed by SSDI prior to release.  
DATA SHEET #: FT0051A  
DOC  

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