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SFF250ZDBTX PDF预览

SFF250ZDBTX

更新时间: 2024-11-15 20:54:15
品牌 Logo 应用领域
SSDI 局域网开关晶体管
页数 文件大小 规格书
3页 116K
描述
Power Field-Effect Transistor, 30A I(D), 200V, 0.085ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-254, HERMETIC SEALED, TO-254Z, 3 PIN

SFF250ZDBTX 技术参数

生命周期:Active零件包装代码:TO-254
包装说明:FLANGE MOUNT, S-XSFM-P3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.63配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:200 V最大漏极电流 (ID):30 A
最大漏源导通电阻:0.085 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-254JESD-30 代码:S-XSFM-P3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:SQUARE
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):125 W认证状态:Not Qualified
子类别:FET General Purpose Powers表面贴装:NO
端子形式:PIN/PEG端子位置:SINGLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SFF250ZDBTX 数据手册

 浏览型号SFF250ZDBTX的Datasheet PDF文件第2页浏览型号SFF250ZDBTX的Datasheet PDF文件第3页 
SFF250M  
SFF250Z  
Solid State Devices, Inc.  
14701 Firestone Blvd * La Mirada, Ca 90638  
Phone: (562) 404-4474 * Fax: (562) 404-1773  
ssdi@ssdi-power.com * www.ssdi-power.com  
DESIGNER’S DATA SHEET  
Part Number / Ordering Information 1/  
30 AMP / 200 Volts  
0.060 Ω typical  
SFF250 __ __ __  
Screening 2/ __ = Not Screen  
TX = TX Level  
N-Channel POWER MOSFET  
TXV = TXV Level  
S = S Level  
Features:  
Lead Option 3/  
__ = Straight Leads  
DB = Down Bend  
UB = Up Bend  
Rugged Construction with Polysilicon Gate Cell  
Low RDS(ON) and High Transconductance  
Excellent High Temperature Stability  
Very Fast Switching Speed  
Fast Recovery and Superior dV/dt Performance  
Increased Reverse Energy Capability  
Package 3/ M = TO-254  
Z = TO-254Z  
Low Input and Transfer Capacitance for Easy Paralleling  
Ceramic Seals Available for Improved Hermeticity  
Hermetically Sealed Surface Mount Power Package  
TX, TXV, Space Level Screening Available  
Replacement for IRFM250 Types  
Maximum Ratings  
Symbol  
Value  
Units  
Volts  
Volts  
Amps  
ºC  
Drain – Source Voltage  
VDS  
VGS  
200  
±20  
Gate – Source Voltage  
Continuous Collector Current  
Operating & Storage Temperature  
ID  
30  
Top & Tstg  
-55 to +150  
Maximum Thermal Resistance  
Junction to Case  
ºC/W  
W
1
RθJC  
PD  
TC = 25ºC  
TC = 55ºC  
125  
95  
Total Device Dissipation  
TO-254 (M)  
TO-254Z (Z)  
For Pin Out Configuration and Optional Lead Bend, See Page 3.  
NOTE: All specifications are subject to change without notification.  
SCD's for these devices should be reviewed by SSDI prior to release.  
DATA SHEET #: F00049E  
DOC  

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