SEMiX453GB17E4Dp
Absolute Maximum Ratings
Symbol Conditions
IGBT
Values
Unit
Tj = 25 °C
VCES
IC
1700
697
530
450
1350
-20 ... 20
V
A
A
A
A
V
Tc = 25 °C
Tc = 80 °C
Tj = 175 °C
ICnom
ICRM
VGES
SEMiX® 3p
Trench IGBT Modules
SEMiX453GB17E4Dp
Features*
VCC = 1000 V
V
V
GE ≤ 15 V
Tj = 150 °C
tpsc
10
µs
°C
CES ≤ 1700 V
Tj
-40 ... 175
Inverse diode
Tj = 25 °C
VRRM
IF
1700
719
529
1200
3510
V
A
A
A
A
Tc = 25 °C
Tc = 80 °C
Tj = 175 °C
IFRM
IFSM
Tj
tp = 10 ms, sin 180°, Tj = 25 °C
• Homogeneous Si
-40 ... 175
°C
• Trench = Trenchgate technology
• VCE(sat) with positive temperature
coefficient
• High short circuit capability
• Press-fit pins as auxiliary contacts
• UL recognized, file no. E63532
Module
It(RMS)
Tstg
600
-40 ... 125
4000
A
°C
V
module without TIM
AC sinus 50Hz, t = 1 min
Visol
Typical Applications
Characteristics
Symbol Conditions
IGBT
• AC inverter drives
• UPS
min.
typ.
max.
Unit
• Renewable energy systems
IC = 450 A
Tj = 25 °C
VCE(sat)
1.90
2.31
2.20
2.60
V
V
Remarks
V
GE = 15 V
Tj = 150 °C
• Product reliability results are valid for
Tj=150°C
chiplevel
Tj = 25 °C
Tj = 150 °C
Tj = 25 °C
Tj = 150 °C
VCE0
rCE
1.10
1.00
1.78
2.9
1.20
1.10
2.2
3.3
6.4
5
V
V
mΩ
mΩ
V
mA
nF
nF
nF
nC
Ω
chiplevel
• Visol between temperature sensor and
power section is only 2500V
VGE = 15 V
chiplevel
• For storage and case temperature with
TIM see document “TP(*) SEMiX 3p”
VGE(th)
ICES
Cies
Coes
Cres
QG
VGE = VCE, IC = 18 mA
VGE = 0 V, VCE = 1700 V, Tj = 25 °C
f = 1 MHz
5.2
5.8
35.4
1.29
1.14
3600
1.7
VCE = 25 V
f = 1 MHz
f = 1 MHz
V
GE = 0 V
VGE = - 8 V...+ 15 V
Tj = 25 °C
RGint
td(on)
tr
Eon
td(off)
tf
VCC = 900 V
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
270
60
142
660
160
ns
ns
mJ
ns
ns
I
C = 450 A
V
R
R
GE = +15/-15 V
G on = 1 Ω
G off = 1 Ω
di/dton = 7200 A/µs
di/dtoff = 2300 A/µs
dv/dt = 3500 V/µs
Ls = 25 nH
Tj = 150 °C
Eoff
155
mJ
Rth(j-c)
Rth(c-s)
per IGBT
per IGBT (λgrease=0.81 W/(m*K))
per IGBT, pre-applied phase change
material
0.06
K/W
K/W
0.029
0.02
Rth(c-s)
K/W
GB
© by SEMIKRON
Rev. 1.0 – 28.01.2022
1