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SEMiX443KD22p PDF预览

SEMiX443KD22p

更新时间: 2024-09-30 14:57:11
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赛米控丹佛斯 - SEMIKRON /
页数 文件大小 规格书
3页 198K
描述
Thyristor / Diode Modules SEMiX 3p (150x62x17)

SEMiX443KD22p 数据手册

 浏览型号SEMiX443KD22p的Datasheet PDF文件第2页浏览型号SEMiX443KD22p的Datasheet PDF文件第3页 
SEMiX443KD22p  
Absolute Maximum Ratings  
Symbol Conditions  
Recitifier Diode  
Values  
Unit  
Tc = 85 °C  
Tc = 100 °C  
Tj = 25 °C  
Tj = 150 °C  
Tj = 25 °C  
Tj = 150 °C  
IFAV  
IFSM  
i2t  
580  
476  
10000  
8200  
500000  
336200  
2300  
A
A
A
Tj = 150 °C  
sin. 180  
10 ms  
10 ms  
A
A²s  
A²s  
V
V
°C  
SEMiX® 3p  
VRSM  
VRRM  
Tj  
2200  
-40 ... 150  
Module  
Tstg  
Visol  
-40 ... 125  
4000  
4800  
°C  
V
V
1 min  
1 s  
SEMiX443KD22p  
Features  
AC sinus 50Hz  
Characteristics  
• Rectifier PEP technology for enhanced  
power and environmental robustness  
• Tjmax = 150°C  
Symbol Conditions  
Diode  
min.  
typ.  
max.  
Unit  
Tj = 25 °C  
Tj = 125 °C  
Tj = 25 °C  
Tj = 125 °C  
Tj = 25 °C  
Tj = 125 °C  
VF  
1.20  
1.17  
0.90  
0.78  
0.17  
0.22  
1.37  
1.36  
0.97  
0.83  
0.22  
0.29  
4.6  
V
V
V
IF = 1812 A  
chiplevel  
• NTC temperature sensor  
• Press-fit pins as auxiliary contacts  
• Terminal height 17 mm  
V(TO)  
rT  
• UL recognised file no. E63532  
V
Typical Applications*  
mΩ  
mΩ  
mA  
K/W  
K/W  
K/W  
chiplevel  
• Input Bridge Rectifier for AC/DC motor  
control  
IRD  
Tj = 125 °C, VRD = VRRM  
• Power supply  
per diode  
Rth(j-c)  
0.09  
sin. 180  
Remarks  
• Product reliability results are valid for  
Tj=150°C  
per Diode (λgrease=0.81 W/(m*K))  
per Diode, pre-applied phase change  
material  
Rth(c-s)  
Rth(c-s)  
0.034  
0.017  
K/W  
• Visol between temperature sensor and  
power section is only 2500V  
Module  
• For storage and case temperature with  
TIM see document “TP(*) SEMiX 3p”  
T
T
C = 25 °C  
C = 125 °C  
RCC'+EE'  
0.4  
0.5  
0.017  
mΩ  
mΩ  
K/W  
measured per  
switch  
Rth(c-s)1  
Rth(c-s)2  
calculated without thermal coupling  
including thermal coupling,  
Ts underneath module (λgrease=0.81 W/  
(m*K))  
0.024  
K/W  
including thermal coupling,  
Ts underneath module, pre-applied  
phase change material  
Rth(c-s)2  
0.013  
K/W  
Ms  
Mt  
a
to heat sink (M5)  
to terminals (M6)  
3
3
6
6
Nm  
Nm  
m/s²  
g
5 * 9.81  
360  
w
Temperature Sensor  
R100  
Tc=100°C (R25=5 kΩ)  
493 ± 5%  
Ω
3550  
±2%  
B100/125  
R(T)=R100exp[B100/125(1/T-1/T100)]; T[K];  
K
KD  
© by SEMIKRON  
Rev. 1.0 – 05.04.2018  
1

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