SEMiX405GARL07E3
Absolute Maximum Ratings
Symbol Conditions
IGBT
Values
Unit
Tj = 25 °C
VCES
IC
650
457
343
400
1200
-20 ... 20
V
A
A
A
A
V
Tc = 25 °C
Tc = 80 °C
Tj = 175 °C
ICnom
ICRM
VGES
ICRM = 3xICnom
VCC = 360 V
SEMiX® 5
V
V
GE ≤ 15 V
CES ≤ 650 V
Tj = 150 °C
tpsc
6
µs
°C
Tj
-40 ... 175
Trench IGBT Modules
Inverse diode
Tj = 25 °C
Engineering Sample
SEMiX405GARL07E3
Target Data
VRRM
IF
650
86
V
A
Tc = 25 °C
Tc = 80 °C
Tj = 175 °C
64
A
IFnom
IFRM
IFSM
Tj
50
A
Features
• Solderless assembling solution with
PressFIT signal pins and screw power
terminals
IFRM = 2xIFnom
tp = 10 ms, sin 180°, Tj = 25 °C
100
A
550
A
-40 ... 175
°C
• IGBT Trench Gate Technology
• VCE(sat) with positive temperature
coefficient
Freewheeling diode
Tj = 25 °C
VRRM
IF
650
484
353
400
800
V
A
A
A
A
Tc = 25 °C
Tc = 80 °C
• Low inductance case
Tj = 175 °C
• Reliable mechanical design with
injection moulded terminals and
reliable internal connections
• UL recognized file no. E63532
• NTC temperature sensor inside
IFnom
IFRM
IFSM
Tj
IFRM = 2xIFnom
tp = 10 ms, sin 180°, Tj = 25 °C
2646
-40 ... 175
A
°C
Typical Applications*
Module
It(RMS)
Tstg
• UPS
450
-40 ... 125
4000
A
°C
V
• 3 Level Inverters
module without TIM
Remarks
Visol
AC sinus 50Hz, t = 1 min
• Case temperature limited to TC=125°
max.
Characteristics
Symbol Conditions
IGBT
• Product reliability results are valid for
min.
typ.
max.
Unit
T
jop=150°C
• Dynamic data are estimated
• For storage and case temperature with
TIM see document “TP(HALA P8)
SEMiX 5p”
IC = 400 A
Tj = 25 °C
VCE(sat)
1.45
1.70
1.90
2.10
V
V
V
GE = 15 V
Tj = 150 °C
chiplevel
Tj = 25 °C
Tj = 150 °C
Tj = 25 °C
Tj = 150 °C
VCE0
rCE
0.90
0.82
1.38
2.2
5.8
0.12
-
24.7
1.54
0.73
5139
1.0
1.00
0.90
2.3
3.0
6.4
V
V
mΩ
mΩ
V
mA
mA
nF
nF
nF
nC
Ω
chiplevel
VGE = 15 V
chiplevel
VGE(th)
ICES
VGE=VCE, IC = 6.4 mA
Tj = 25 °C
5.1
0.3
VGE = 0 V
CE = 650 V
V
Tj = 150 °C
f = 1 MHz
f = 1 MHz
f = 1 MHz
Cies
Coes
Cres
QG
VCE = 25 V
GE = 0 V
V
VGE = - 15 V...+ 15 V
Tj = 25 °C
RGint
GARL
© by SEMIKRON
Rev. 0.4 – 05.04.2018
1