Datasheet > SDM10P45_08

SDM10P45_08

更新时间： 2024-09-22 09:30:23

品牌	Logo	应用领域
美台 - DIODES		肖特基二极管
页数	文件大小	规格书
3页	107K
描述
SURFACE MOUNT SCHOTTKY BARRIER DIODE

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中文翻译

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SDM10P45_08 数据手册

SDM10P45

SURFACE MOUNT SCHOTTKY BARRIER DIODE

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Features

Mechanical Data

•

Ultra-Small Surface Mount Package

Low Forward Voltage Drop

Fast Switching

PN Junction Guard Ring for Transient and ESD Protection

Lead Free/RoHS Compliant (Note 3)

Qualified to AEC-Q101 Standards for High Reliability

"Green" Device (Notes 4 and 5)

•

Case: SOT-523

Case Material: Molded Plastic. UL Flammability Classification

Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020D

Terminals: Solderable per MIL-STD-202, Method 208

Lead Free Plating (Matte Tin Finish annealed over Alloy 42

leadframe).

Polarity: See Diagram

Marking Information: See Page 2

Ordering Information: See Page 2

Weight: 0.002 grams (approximate)

•

Top View

Device Schematics

Maximum Ratings @T = 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

V_RRM

V_RWM

V_R

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

RMS Reverse Voltage

100

1.0

V_R(RMS)

I_FM

Forward Continuous Current

Forward Surge Current

(Note 1)

@ t < 8.3ms

I_FSM

Thermal Characteristics

Characteristic

Power Dissipation

Symbol

Value

120

Unit

°C/W

°C

(Note 1)

P_D

Thermal Resistance Junction to Ambient Air

Operating and Storage Temperature Range

833

R_θ

-40 to +125

T_J, T_STG

Electrical Characteristics @T = 25°C unless otherwise specified

Characteristic

Reverse Breakdown Voltage

Symbol

Min

Typ

Max

Unit

Test Condition

(Note 2)

V_(BR)R

⎯

I_R= 100μA

370

470

450

600

I_F= 10mA

I_F= 50mA

⎯

Forward Voltage

V_F

Reverse Leakage Current

Total Capacitance

0.07

6.0

1.0

I_R

⎯

μA

V_R= 10V

C_T

⎯

V_R= 10V, f = 1.0MHz

Notes:

1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at

http://www.diodes.com/datasheets/ap02001.pdf.

2. Short duration pulse test used to minimize self-heating effect.

3. No purposefully added lead.

4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

1 of 3

www.diodes.com

July 2008

SDM10P45

Document number: DS30287 Rev. 12 - 2

12 3

中文翻译

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