是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | TFBGA-153 |
针数: | 153 | Reach Compliance Code: | unknown |
风险等级: | 5.77 | JESD-30 代码: | R-PBGA-B153 |
长度: | 13 mm | 内存密度: | 17179869184 bit |
内存集成电路类型: | FLASH | 内存宽度: | 8 |
湿度敏感等级: | 3 | 功能数量: | 1 |
端子数量: | 153 | 字数: | 2147483648 words |
字数代码: | 2000000000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -25 °C |
组织: | 2GX8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | NOT SPECIFIED | 编程电压: | 3.3 V |
座面最大高度: | 1 mm | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 类型: | NAND TYPE |
宽度: | 11.5 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
SDIN5D1-2G-LT | SANDISK |
获取价格 |
Flash, 2GX8, PBGA153, TFBGA-153 | |
SDIN7DP4-64G | SANDISK |
获取价格 |
Flash, 64GX8, PBGA153, TFBGA-153 | |
SDIN7DP4-64G-Q | SANDISK |
获取价格 |
Flash, 64GX8, PBGA153, TFBGA-153 | |
SDINADB4-16G | SANDISK |
获取价格 |
Flash Memory Drive, CMOS, PACKAGE | |
SDINADF4-128G | ETC |
获取价格 |
Transforming possibilities into reality | |
SDINADF4-128G-H | ETC |
获取价格 |
Transforming possibilities into reality | |
SDINADF4-16G | ETC |
获取价格 |
Transforming possibilities into reality | |
SDINADF4-16G-H | ETC |
获取价格 |
Transforming possibilities into reality | |
SDINADF4-32G | ETC |
获取价格 |
Transforming possibilities into reality | |
SDINADF4-32G-H | ETC |
获取价格 |
Transforming possibilities into reality |