Datasheet > SC7777D

SC7777D

更新时间： 2024-09-23 06:10:19

品牌	Logo	应用领域
大兴电工 - KOA		/
页数	文件大小	规格书
1页	56K
描述
hybrid IC

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数据手册

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SC7777D 数据手册

KA, SC

hybrid IC

features

NEW

• Adjustment processes are decreased

by function and ratio trimmings

• High density mounting by bonding (COB)

• Various types of package are available

• High reliability achieved by KOA’s original thick

film technology

• Thick film printed circuit substrate applies the non-noble

metal paste (conductive paste and resistive paste) and

receives the many total inquires including material

selecting, pattern designing and mass production

ordering information

New Part #

7777

Product

Code

KOA Ref.

Number

Terminal Surface

Material

KA: Hybrid IC

SC: Non-Noble

D: SnAgCu

T: Sn

Component - KA/CB Series

Item

AI₂O₃Alumina

Printing

Mounting

Bonding

Substrate Materials

Glass epoxy

Item

Conductor resistance

Heat shock

RuO₂

Ag-Pd

18m

Ag-Pt

Ω/

/15µmµ

Ω/

/10µm

2mΩ/ /20µm

Conductors, Resistors

-55°C~+125°C 300 Cycles -55°C~+125°C 500 Cycles -55°C~+125°C 500 Cycles

Ω

~10M 10 ~1M

Ω

100x10^-6/K 100x10^-6/k

Ω

Item

Specifications

Au Wire, AI Wire

0.8mm Pitch~

COB

BGA

Mounting

QFP

0.4mm Pitch~

Chip

Package

SIP

DIP, SOP

ZIP

0.6mm x 0.3mm (0.4mm x 0.2mm)~

Lead Pitch

1.8mm, 2.0mm, 2.5mm, 2.54mm

1.27mm, 1.8mm, 2.54mm

2.54mm

Package, Outside Terminals

Over Coating, Plating

Over Coating

Color

UL Standard

94 V0 Approved

94 V1 Approved

Epoxy metamorphic phenol Black

Epoxy

Black

o= Available

x= Not available

Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.

1/08/09

249

KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com

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