SB580EB-G

更新时间： 2024-11-10 07:17:55

品牌	Logo	应用领域
上华 - COMCHIP		/
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描述
ESD Leaded Schottky Barrier Rectifiers

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中文翻译

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数据手册

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SB580EB-G 数据手册

ESD Leaded Schottky Barrier Rectifiers

Comchip

S M D D i o d e S p e c i a l i s t

SB520E-G Thru. SB5100E-G

Voltage: 20 to 100 V

Current: 5.0 A

RoHS Device

DO-201AD

Features

-Low drop down voltage.

-5.0A operation at TA=75°C with no thermal runaway.

-For use in low voltage, high frequency invertors free

wheeling and polarity protection.

1.0(25.4) Min.

0.210(5.3)

0.189(4.8)

-Silicon epitaxial planar chips.

-ESD test under IEC6100-4-2 :

Standard: >15KV(Air) & 8KV(Contact)

0.375(9.5)

0.287(7.3)

-Lead-free part, meet RoHS requirements.

Mechanical data

1.0(25.4) Min.

0.052(1.3)

0.048(1.2)

-Epoxy: UL94-V0 rated flame retardant

-Case: Molded plastic body DO-201AD

-Terminals: Solderable per MIL-STD-750 Method 2026

-Polarity: Color band denotes cathode end

-Mounting Position: Any

Dimensions in inches and (millimeter)

-Weight: 1.12grams

Electrical Characteristics (at TA=25°C unless otherwise noted)

Ratings at 25°C ambient temperature unless otherwise specified.

Symbol

Parameter

Unit

520E-G 540E-G 545E-G 550E-G 560E-G 580E-G 5100E-G

Maximum recurrent peak reverse voltage

Maximum RMS voltage

VRRM

VRMS

VDC

100

Maximum DC blocking voltage

100

Maximum average forward rectified current

0.5” (12.7mm) lead length at TA=75°C, See Figure 1

I(AV)

5.0

Peak forward surge current

8.3ms single half sine-wave superimposed on rated load

(JEDEC method) TL=110°C

150

125

IFSM

Maximum forward voltage at 5.0A (Note 1)

0.55

0.70

0.85

0.5

Maximum DC reverse current

At rated DC blocking voltage

=25°C

=100°C

Typical junction capacitance (Note 2)

Typical thermal resistance (Note 3)

500

RθJA

RθJL

35.0

15.0

°C/W

Operating junction temperature range

Storage temperature range

-65 to +125

-65 to +150

°C

TSTG

-65 to +150

NOTES:

1. Pulse test : 300µS pulse width, 1% duty cycle.

2. Measured at 1.0MHz and applied reverse voltage of 4.0 Volts.

3. Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted 0.500” (12.7mm) lead length with 2.5x2.5” (63.5x63.5mm) copper

pad.

REV:A

Page 1

QW-BB043

Comchip Technology CO., LTD.

12 3

中文翻译

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