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SB1620CT_T0_00001 PDF预览

SB1620CT_T0_00001

更新时间: 2024-11-26 01:16:43
品牌 Logo 应用领域
强茂 - PANJIT 分离技术隔离技术
页数 文件大小 规格书
4页 291K
描述
ISOLATION SCHOTTKY BARRIER RECTIFIERS

SB1620CT_T0_00001 数据手册

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SB1620CT~SB1660CT  
ISOLATION SCHOTTKY BARRIER RECTIFIERS  
20 to 60 Volt  
16 Ampere  
VOLTAGE  
CURRENT  
FEATURES  
• Plastic package has Underwriters Laboratory  
Flammability Classification 94V-O utilizing  
Flame Retardant Epoxy Molding Compound.  
• Low power loss, high efficiency.  
• Low forward voltage, high current capability  
• High surge capacity.  
• For use in low voltage, high frequency inverters  
free wheeling, and polarlity protection applications.  
• Lead free in compliance with EU RoHS 2011/65/EU directive  
• Green molding compound as per IEC61249 Std. . (Halogen Free)  
MECHANICAL DATA  
• Case: TO-220AB molded plastic package  
Terminals: Lead solderable per MIL-STD-750, Method 2026  
• Polarity: As marked.  
• Weight: 0.067 ounces, 1.89 grams  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS  
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.  
For capacitive load, derate current by 20%  
SB1620CT SB1630CT SB1640CT SB1645CT SB1650CT SB1660CT  
PARAMETER  
SYMBOL  
VRRM  
UNITS  
V
Maximum Recurrent Peak Reverse Voltage  
20  
14  
20  
30  
21  
30  
40  
28  
40  
45  
31.5  
45  
50  
35  
50  
60  
42  
60  
Maximum RMS Voltage  
VRMS  
VDC  
IF(AV)  
IFSM  
VF  
V
V
A
A
V
Maximum DC Blocking Voltage  
Maximum Average Forward Current lead length at TC=75O  
C
16  
Peak Forward Surge Current : 8.3ms single half sine-wave  
superimposed on rated load  
150  
Maximum Forward Voltage at 8A per leg  
0.55  
0.75  
Maximum DC Reverse Current at Rated DC Blocking  
Voltage  
TJ=25O  
TJ=100O  
C
C
0.2  
100  
0.1  
100  
IR  
mA  
Typical Thermal Resistance  
RθJC  
2
OC / W  
Operating Junction Temperature Range  
Storage Temperature Range  
T
J
-55 to +125  
-55 to +150  
OC  
T
STG  
-55 to +150  
OC  
NOTES:  
Both Bonding and Chip structure are available.  
October 24,2012-REV.06  
PAGE . 1  

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