SPICE MODELS: SB120 SB130 SB140 SB150 SB160
SB120 - SB160
1.0A SCHOTTKY BARRIER RECTIFIER
Features
·
·
·
·
·
·
·
Schottky Barrier Chip
Guard Ring Die Construction for Transient Protection
Low Power Loss, High Efficiency
High Surge Capability
A
B
A
High Current Capability and Low Forward Voltage Drop
Surge Overload Rating to 40A Peak
For Use in Low Voltage, High Frequency Inverters, Free
Wheeling, and Polarity Protection Applications
C
·
Lead Free Finish, RoHS Compliant (Note 3)
D
Mechanical Data
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·
Case: DO-41 Plastic
DO-41 Plastic
Min
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Dim
A
Max
¾
25.40
4.06
·
·
Moisture Sensitivity: Level 1 per J-STD-020C
B
5.21
0.864
2.72
Terminals: Finish - Bright Tin. Plated Leads Solderable per
MIL-STD-202, Method 208
C
0.71
·
·
·
·
·
Polarity: Cathode Band
D
2.00
Mounting Position: Any
All Dimensions in mm
Ordering Information: See Last Page
Marking: Type Number
Weight: 0.3 grams (approximate)
@ TA = 25°C unless otherwise specified
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
SB120
20
SB130
30
SB140
SB150
50
SB160
60
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
40
V
VR(RMS)
IO
RMS Reverse Voltage
14
21
28
35
42
V
A
Average Rectified Output Current
(Note 1)
1.0
(See Figure 1)
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
(JEDEC Method)
IFSM
VFM
IRM
40
A
Forward Voltage (Note 2)
@ IF = 1.0A
0.50
10
0.70
5.0
V
0.5
Peak Reverse Current
at Rated DC Blocking Voltage (Note 2)
@ TA 25°C
=
mA
@ TA = 100°C
RqJL
RqJA
Tj
Typical Thermal Resistance Junction to Lead (Note 1)
Typical Thermal Resistance Junction to Ambient
Operating Temperature Range
15
50
°C/W
°C/W
-65 to +125
-65 to +150
°C
TSTG
Storage Temperature Range
-65 to +150
Notes: 1. Measured at ambient temperature at a distance of 9.5mm from the case.
2. Short duration test pulse used to minimize self-heating effect.
3. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
DS23022 Rev. 5 - 2
1 of 3
SB120-SB160
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