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SAL1-120-01-S-S-A PDF预览

SAL1-120-01-S-S-A

更新时间: 2024-11-25 21:07:55
品牌 Logo 应用领域
申泰 - SAMTEC PC连接器
页数 文件大小 规格书
1页 759K
描述
Card Edge Connector, 20 Contact(s), 1 Row(s), Female, Straight, 0.039 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, Socket, ROHS COMPLIANT

SAL1-120-01-S-S-A 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:ROHS COMPLIANTReach Compliance Code:compliant
风险等级:5.77其他特性:SATALINK, LOW PROFILE
主体/外壳类型:SOCKET连接器类型:CARD EDGE CONNECTOR
联系完成配合:MATTE TIN OVER NICKEL联系完成终止:Matte Tin (Sn) - with Nickel (Ni) barrier
触点性别:FEMALE触点材料:NOT SPECIFIED
触点模式:RECTANGULAR触点样式:SQ PIN-SKT
DIN 符合性:NO滤波功能:NO
IEC 符合性:NO绝缘体颜色:BLACK
绝缘体材料:LIQUID CRYSTAL POLYMER (LCP)JESD-609代码:e3
MIL 符合性:NO插接触点节距:0.039 inch
混合触点:NO安装选项1:LOCKING
安装方式:STRAIGHT安装类型:BOARD
连接器数:ONEPCB行数:2
装载的行数:1最高工作温度:125 °C
最低工作温度:-55 °C选件:GENERAL PURPOSE
PCB接触模式:RECTANGULAR电镀厚度:30u inch
极化密钥:POLARIZED HOUSING可靠性:COMMERCIAL
子类别:Headers and Edge Type Connectors端子节距:1 mm
端接类型:SURFACE MOUNT触点总数:20
Base Number Matches:1

SAL1-120-01-S-S-A 数据手册

  
F-213  
SAL1–127–01–S–S–A  
SAL1–120–01–S–S–A  
SAL1–140–01–S–S–A  
(1,00 mm) .0394"  
SAL1 SERIES  
HIGH SPEED MICRO PLANE SOCKET  
Mount in pairs on  
same side or opposite  
sides for easy  
Surface  
Mount  
Mates with:  
(1,60 mm) .062" or  
(2,40 mm) .093" card  
SPECIFICATIONS  
signal routing  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?SAL1  
Insulator Material:  
Black LCP  
APPLICATION  
Weld tab  
Contact Material:  
BeCu  
SPECIFIC OPTION  
Plating:  
Heavy Gold plating available.  
Call Samtec.  
Au or Sn over  
50µ" (1,27 µm) Ni  
Operating Temp:  
-55°C to +125°C  
Current Rating:  
2.3 A per contact @ 80°C  
RoHS Compliant:  
Yes  
Variable mating  
card thickness  
SAL1  
Rated @ 3dB Insertion Loss*  
Compatible  
SATALink™ is a trademark  
of Silicon Image Inc.  
Processing:  
Lead–Free Solderable:  
Yes  
SMT Lead Coplanarity:  
(0,10 mm) .004" max  
Top or  
Single-Ended Signaling  
Bottom  
8.5 GHz / 17 Gbps  
Differential Pair Signaling Top  
Differential Pair Signaling Bottom  
*Performance data includes effects of a non-optimized PCB.  
9 GHz / 18 Gbps  
10 GHz / 20 Gbps  
Large deflection  
BeCu contact  
Complete test data available at www.samtec.com?SAL1  
or contact sig@samtec.com  
ALSO AVAILABLE  
NO. OF  
POSITIONS  
PLATING  
OPTION  
1
01  
SAL1  
S
A
HSEC8-PE  
–S  
20, 27, 30, 40  
= 30µ" (0,76 µm) Gold on contact, Matte Tin on tail  
Note: Other Gold plating options available.  
Contact Samtec.  
See HSEC8-PE Series for other  
card pass-through options.  
APPLICATIONS  
No. of Positions x (1,00) .03937 + (7,80) .3071  
(1,00) .03937  
(0,23) .009  
(5,45)  
.215  
(1,50)  
.059  
No. of Positions x (1,00) .03937 + (1,50) .0591  
Pass-Through  
Low Profile  
(1,90)  
.075  
Same side mount  
(6,16)  
.243  
(0,25)  
.010  
Note: While optimized for  
50Ω applications, this  
(1,20)  
.047  
DIA  
connector with alternative  
signal/ground patterns may  
also perform well in certain  
75Ω applications. Contact  
Samtec for further information.  
No. of Positions x (1,00) .03937 + (3,80) .1496  
No. of Positions x (1,00) .03937 + (8,60) .3386  
(2,10)  
.083  
Note: Some lengths,  
styles and options are  
non-standard, non-returnable.  
WWW.SAMTEC.COM  

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