生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | SOP, | 针数: | 8 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 0.67 | 模拟集成电路 - 其他类型: | SPDT |
JESD-30 代码: | R-PDSO-G8 | JESD-609代码: | e4 |
长度: | 4.9 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 8 | 标称断态隔离度: | 30 dB |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 1.75 mm | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 3 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | BICMOS |
温度等级: | INDUSTRIAL | 端子面层: | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 3.9 mm | Base Number Matches: | 1 |
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