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S9S08AW16AE0CLC PDF预览

S9S08AW16AE0CLC

更新时间: 2024-11-06 15:18:11
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
339页 5934K
描述
8-bit MCU, S08 core, 16KB Flash, 40MHz, -40/+85degC, Automotive Qualified, QFP 32

S9S08AW16AE0CLC 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:QFP
包装说明:7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MS-026BBA, LQFP-32针数:32
Reach Compliance Code:unknownECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:5.79
具有ADC:YES地址总线宽度:
位大小:8最大时钟频率:16 MHz
DAC 通道:NODMA 通道:NO
外部数据总线宽度:JESD-30 代码:S-PQFP-G32
JESD-609代码:e3长度:7 mm
湿度敏感等级:3I/O 线路数量:22
端子数量:32最高工作温度:125 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装等效代码:QFP32,.35SQ,32封装形状:SQUARE
封装形式:FLATPACK, LOW PROFILE峰值回流温度(摄氏度):260
电源:3/5 V认证状态:Not Qualified
RAM(字节):1024ROM(单词):16384
ROM可编程性:FLASH筛选级别:AEC-Q100
座面最大高度:1.6 mm速度:40 MHz
子类别:Microcontrollers最大压摆率:18.5 mA
最大供电电压:5.5 V最小供电电压:2.7 V
标称供电电压:5 V表面贴装:YES
技术:CMOS温度等级:AUTOMOTIVE
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:0.8 mm端子位置:QUAD
处于峰值回流温度下的最长时间:40宽度:7 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLER

S9S08AW16AE0CLC 数据手册

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Document Number: QFN_Addendum  
Rev. 0, 07/2014  
Freescale Semiconductor  
Addendum  
Addendum for New QFN  
Package Migration  
This addendum provides the changes to the 98A case outline numbers for products covered in this book.  
Case outlines were changed because of the migration from gold wire to copper wire in some packages. See  
the table below for the old (gold wire) package versus the new (copper wire) package.  
To view the new drawing, go to Freescale.com and search on the new 98A package number for your  
device.  
For more information about QFN package use, see EB806: Electrical Connection Recommendations for  
the Exposed Pad on QFN and DFN Packages.  
© Freescale Semiconductor, Inc., 2014. All rights reserved.  

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