Datasheet > S72WS256ND0BFW4Y3

S72WS256ND0BFW4Y3

更新时间： 2024-11-27 04:06:43

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S72WS256ND0BFW4Y3 数据手册

S72WS-N Based MCP/PoP Products

1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus

256/512 Mb Simultaneous Read/Write, Burst Mode Flash Memory

512 Mb NAND Flash

1024 Mb NAND Interface ORNAND Flash Memory on Bus 1

512/256/128 Mb (8M/4M/2M x 16-bit x 4 Banks) Mobile SDRAM on Bus 2

ADVANCE

INFORMATION

Data Sheet

Notice to Readers: This document states the current technical specifications

regarding the Spansion product(s) described herein. Each product described

herein may be designated as Advance Information, Preliminary, or Full

Production. See “Notice On Data Sheet Designations” for definitions.

Publication Number S72WS-N_00 Revision A Amendment 8 Issue Date June 1, 2006

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型号	品牌	获取价格	描述	数据表
S72WS256ND0BFW93	SPANSION	获取价格	Based MCP/PoP Products
S72WS256ND0BFW930	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137
S72WS256ND0BFW932	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137
S72WS256ND0BFW933	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137
S72WS256ND0BFWB7	SPANSION	获取价格	Based MCP/PoP Products
S72WS256ND0BFWB70	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137
S72WS256ND0BFWB72	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137
S72WS256ND0BFWBB	SPANSION	获取价格	Based MCP/PoP Products
S72WS256ND0BFWBB2	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137
S72WS256ND0KFW4Y0	SPANSION	获取价格	Based MCP/PoP Products