是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | FBGA, BGA133,14X14,20 | Reach Compliance Code: | compliant |
风险等级: | 5.29 | Is Samacsys: | N |
JESD-30 代码: | S-PBGA-B133 | 内存密度: | 536870912 bit |
内存集成电路类型: | MEMORY CIRCUIT | 内存宽度: | 16 |
混合内存类型: | FLASH+SDRAM | 端子数量: | 133 |
字数: | 33554432 words | 字数代码: | 32000000 |
最高工作温度: | 85 °C | 最低工作温度: | -25 °C |
组织: | 32MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | FBGA | 封装等效代码: | BGA133,14X14,20 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, FINE PITCH |
电源: | 1.8 V | 认证状态: | Not Qualified |
子类别: | Other Memory ICs | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
S72NS512RE0AHGL40 | SPANSION |
获取价格 |
Memory Circuit, Flash+SDRAM, 32MX16, CMOS, PBGA133, 11 X 10 MM, 0.50 MM PITCH LEAD FREE, F | |
S72NS512RE0AHGL43 | SPANSION |
获取价格 |
Memory Circuit, Flash+SDRAM, 32MX16, CMOS, PBGA133, 11 X 10 MM, 0.50 MM PITCH LEAD FREE, F | |
S72NS512RE0AJGL00 | SPANSION |
获取价格 |
Memory IC, | |
S72NS512RE0AJGL03 | SPANSION |
获取价格 |
Memory IC, | |
S72NS512RE0AJGLG0 | SPANSION |
获取价格 |
Memory IC, | |
S72NS512RE0AJGLG3 | SPANSION |
获取价格 |
Memory IC, | |
S72NS512RE0KHFG03 | SPANSION |
获取价格 |
Memory Circuit, 32MX16, CMOS, PBGA128, 12 X 12 MM, FBGA-128 | |
S72NS512RE0KHFG40 | SPANSION |
获取价格 |
Memory Circuit, Flash+SDRAM, 32MX16, CMOS, PBGA128, 12 X 12 MM, FBGA-128 | |
S72NS512RE0KHFG43 | SPANSION |
获取价格 |
Memory Circuit, Flash+SDRAM, 32MX16, CMOS, PBGA128, 12 X 12 MM, FBGA-128 | |
S72NS512RE0KHFL00 | SPANSION |
获取价格 |
Memory Circuit, 32MX16, CMOS, PBGA128, 12 X 12 MM, FBGA-128 |