Datasheet > S71AL016D02-T7

S71AL016D02-T7

更新时间： 2024-11-23 09:01:19

品牌	Logo	应用领域
飞索 - SPANSION		闪存
页数	文件大小	规格书
76页	1444K
描述
Stacked Multi-Chip Product (MCP) Flash Memory and RAM

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S71AL016D02-T7 数据手册

S71AL016D based MCPs

Stacked Multi-Chip Product (MCP) Flash Memory and

RAM

16 Megabit (1 M x 16-bit) CMOS 3.0 Volt-only

Flash Memory and 2 Megabit (128K x 16-bit) Static RAM/

Pseudo Static RAM

ADVANCE

INFORMATION

Distinctive Characteristics

Packages

— 7 x 9 x 1.2 mm 56 ball FBGA

MCP Features

Power supply voltage of 2.7 to 3.1 volt

Operating Temperature

High performance

— –25°C to +85°C (Wireless)

— 70 ns

General Description

The S71AL series is a product line of stacked Multi-Chip Product (MCP) packages

and consists of:

One S29AL Flash memory die

pSRAM or SRAM

The products covered by this document are listed in the table below:

Flash Memory Density

16Mb

SRAM Density

2Mb

S71AL016D02

Publication Number S71AL016D_02_04_00 Revision A Amendment 1 Issue Date November 11, 2004

12 3 4 5 6 7...76

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型号	品牌	获取价格	描述	数据表
S71AL016D02-TF	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016M	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016M40	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016M40BAW0B3	SPANSION	获取价格	Memory Circuit, 1MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, VFBGA-56
S71AL016M40BAW0F3	SPANSION	获取价格	Memory Circuit, 1MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, VFBGA-56
S71AL016M40BFW0F0	SPANSION	获取价格	Memory Circuit, 1MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-56
S71AL016M40BFW0F2	SPANSION	获取价格	Memory Circuit, 1MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-56
S71AL016M40BFW0F3	SPANSION	获取价格	Memory Circuit, 1MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, VFBGA-56
S71GL016A	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL016A40	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM