Datasheet > S7199-01F

S7199-01F

更新时间： 2024-09-16 21:10:51

品牌	Logo	应用领域
HAMAMATSU		传感器换能器
页数	文件大小	规格书
9页	259K
描述
CCD Sensor, 1536 Horiz pixels, 128 Vert pixels, 5-11V, Rectangular, Through Hole Mount, CERAMIC PACKAGE-40

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S7199-01F 技术参数

是否Rohs认证：	符合	生命周期：	Active
Reach Compliance Code：	unknown	风险等级：	5.73
其他特性：	SENSITIVITY 0.6 MICRO VOLT PER ELECTRON	阵列类型：	FULL FRAME TRANSFER
主体宽度：	28 mm	主体高度：	5.2 mm
主体长度或直径：	150 mm	动态范围：	86 dB
水平像素：	1536	外壳：	CERAMIC
安装特点：	THROUGH HOLE MOUNT	最高工作温度：	40 °C
最低工作温度：		输出范围：	5-11V
输出类型：	ANALOG VOLTAGE	封装形状/形式：	RECTANGULAR
像素大小：	48X48 µm	传感器/换能器类型：	IMAGE SENSOR,CCD
子类别：	CCD Image Sensors	表面贴装：	NO
端接类型：	SOLDER	垂直像素：	128
Base Number Matches：	1

S7199-01F 数据手册

TDI-CCD area image sensor

S7199-01/-01F

Image sensor with a long, narrow photosen-

sitive area for X-ray imaging

The S7199-01 is a front-illuminated FFT-CCD image sensor developed for X-ray imaging. An FOS (Fiber Optic plate with

Scintillator) sensitive to X-rays is directly coupled to the CCD chips, allowing X-ray imaging with high sensitivity. Two CCD

chips are arranged in close proximity to conﬁgure a long photosensitive area (approx. 150 mm).

The S7199-01 CCD image sensor features TDI mode operation that allows capturing clear, sharp X-ray images of objects

moving on a belt conveyor, making it ideal for non-destructive X-ray inspection. FOP type not coated with scintillator mate-

rial is also provided (S7199-01F).

Features

Applications

1536 × 128 pixel (× 2 chips)

Pixel size: 48 × 48 μm

General X-ray imaging

Non-destructive inspection

Dental panorama

Buttable structure of 2 chips

TDI (time delay integration) operation

100% ﬁll factor

Wide dynamic range

Low dark current

Low readout noise

MPP operation

Speciﬁcations

Parameter

CCD structure

Window

S7199-01

S7199-01F

Full frame transfer or TDI

FOS (ﬁber optic plate with scintillator)

FOP (ﬁber optic plate)*

Photosensitive area (H × V)

X-ray sensitive area

Pixel size (H × V)

Number of total pixels (H × V)

Number of effective pixels (H × V)

Fill factor

73.728 × 6.144 mm (× 2 chips)

146 × 6 mm

48 × 48 μm

1536 × 128 (× 2 chips)

100%

Vertical clock phase

Horizontal clock phase

Output circuit

2 phases

Two-stage MOSFET source follower with load resistance

X-ray resolution

Total dose irradiation

Package

4 to 6 Lp/mm at 60 kVp, 20 μGy

50 Gy max.

40-pin ceramic

Non-cooled

Cooling

*1: When using this product for X-ray detection, the user needs to afﬁx a phosphor sheet, etc. to the FOP.

www.hamamatsu.com

12 3 4 5 6 7...9

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S71AL016D02BAWTF2	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWTF3	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02-BF	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM

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