Datasheet > S7199-01_11

S7199-01_11

更新时间： 2024-09-16 07:16:55

品牌	Logo	应用领域
HAMAMATSU		传感器图像传感器
页数	文件大小	规格书
8页	158K
描述
CCD area image sensor Front-illuminated FFT-CCDs for X-ray imaging

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S7199-01_11 数据手册

I M A G E S E N S O R

CCD area image sensor

S7199-01

Front-illuminated FFT-CCDs for X-ray imaging

S7199-01 is a family of FFT-CCD image sensors specifically designed for X-ray imaging. A FOS (Fiber Optic plate with

Scintillator) that converts X-ray into visible-light is mounted on the CCD chip, which enables S7199-01 to acquire the X-ray

imaging. Two CCD chips of symmetric from side to side are mounted closely for realizing the possible minimum dead space in

between. The effective photosensitive length of about 150 mm in total is realized; each chip has 1536 × 128 pixels and the pixel

size is 48 × 48 µm. Even a X-ray image of moving object can be taken by taking a unique operation method of TDI, which can also

be useful for a non-destructive inspection where the object moves on a belt conveyer.

The each chip of S7199-01 has an effective pixel size of 48 × 48 µm and is available in active area of 73.728 (H) × 6.144 (V) mm².

FOP type is also available (S7199-01F).

Features

Applications

1536 (H) × 128 (V) pixel format

Pixel size: 48 × 48 µm

Buttable structure of 2 chips

Coupled with FOS for X-ray imaging

TDI (Time Delay Integration) operation

100 % fill factor

General X-ray imaging

Non-destructive inspection

Dental panorama

Wide dynamic range

Low dark signal

Low readout noise

MPP operation

ꢀ Selection guide

Type No.

Number of

total pixels

Number of

active pixels

Active area

[mm (H) × mm(V)]

W indow

Cooling

FOS

S7199-01

(fiber optic plate

with scintillator)

FOP

Non-cooled

1536 × 128

73.728 × 6.144

S7199-01F*

(fiber optic plate)

Note) As an input window, FOS is suited to S7199-01.

* W hen this product is used for X-ray detection applications, the user should assemble a scintillator or phosphor sheet.

ꢀ General ratings

Parameter

S7199-01

S7199-01F

CCD structure

Fill factor

Full frame transfer or TDI

100 %

Number of active pixels

Pixel size

CCD active area

X-ray sensitive area

Vertical clock phase

Horizontal clock phase

Output circuit

1536 (H) × 128 (V) *¹

48 (H) × 48 (V) µm

73.728 (H) × 6.144 (V) mm *¹

146 × 6 mm

2 phase

Two-stage MOSFET source follower with load resistance

4 to 6 Lp/mm at 60 kVp, 20 µGy

X-ray resolution

Total dose irradiation

Package

50 Gy max.

40 pin ceramic package

*1: Number of active pixels per chip. Two chips are used.

12 3 4 5 6 7 8

中文翻译

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与S7199-01_11相关器件

型号	品牌	获取价格	描述	数据表
S7199-01_15	HAMAMATSU	获取价格	TDI-CCD area image sensor
S7199-01F	HAMAMATSU	获取价格	CCD Sensor, 1536 Horiz pixels, 128 Vert pixels, 5-11V, Rectangular, Through Hole Mount, CE
S71AL016D	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02-B7	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWBF0	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWBF2	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWBF3	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWTF0	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWTF2	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM

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