Datasheet > S7199-01

S7199-01

更新时间： 2024-11-23 04:06:47

品牌	Logo	应用领域
HAMAMATSU		传感器图像传感器
页数	文件大小	规格书
7页	143K
描述
CCD area image sensor Front-illuminated FFT-CCDs for X-ray imaging

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中文翻译

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技术参数
数据手册

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S7199-01 技术参数

是否Rohs认证：	符合	生命周期：	Active
Reach Compliance Code：	unknown	风险等级：	5.73
其他特性：	SENSITIVITY 0.6 MICRO VOLT PER ELECTRON	阵列类型：	FULL FRAME TRANSFER
主体宽度：	28 mm	主体高度：	5.6 mm
主体长度或直径：	150 mm	动态范围：	86 dB
水平像素：	1536	外壳：	CERAMIC
安装特点：	THROUGH HOLE MOUNT	最高工作温度：	40 °C
最低工作温度：		输出范围：	5-11V
输出类型：	ANALOG VOLTAGE	封装形状/形式：	RECTANGULAR
像素大小：	48X48 µm	传感器/换能器类型：	IMAGE SENSOR,CCD
子类别：	CCD Image Sensors	最大供电电压：	15 V
最小供电电压：	12 V	表面贴装：	NO
端接类型：	SOLDER	垂直像素：	128
Base Number Matches：	1

S7199-01 数据手册

I M A G E S E N S O R

CCD area image sensor

S7199-01

Front-illuminated FFT-CCDs for X-ray imaging

S7199-01 is a family of FFT-CCD image sensors specifically designed for X-ray imaging. FOS (Fiber Optic plate with Scintillator)

that converts X-ray into visible-light is mounted on a CCD chip, which enables S7199-01 to acquire the X-ray imaging. Two CCD

chips of symmetric from side to side are mounted closely for realizing the possible minimum dead space in between. The effective

photosensitive length of about 150 mm in total is realized; each chip has 1536 × 128 channels, and 48 × 48 µm is a pixel size.

Even a X-ray image of moving object can be taken by taking a unique operation method of TDI, which can also be useful for a

non-destructive inspection where the object moves on a belt conveyer.

The each chip of S7199-01 has an effective pixel size of 48 × 48 µm and is available in active area of 73.728 (H) × 6.144 (V) mm².

S7199-01 is pin compatible with S7199. (Operating condition is a little bit changed from S7199)

Features

Applications

1536 (H) × 128 (V) pixel format

Pixel size: 48 × 48 µm

Buttable structure of 2 chips

Coupled with FOS for X-ray imaging

TDI (Time Delay Integration) operation

100 % fill factor

General X-ray imaging

Non-destructive inspection

Dental panorama

Wide dynamic range

Low dark signal

Low readout noise

MPP operation

ꢀ Selection guide

Type No.

S7199-01

Number of

total pixels

1536 × 128

Number of

active pixels

1536 × 128

Active area

[mm (H) × mm(V)]

73.728 × 6.144

Cooling

Non-cooled

Note) As an input window, FOS is suited to S7199-01.

General ratings

ꢀ

Parameter

Specification

Full frame transfer or TDI

100 %

CCD structure

Fill factor

Number of active pixels

Pixel size

CCD active area

1536 (H) × 128 (V) *¹

48 (H) × 48 (V) µm

73.728 (H) × 6.144 (V) mm *¹

146 × 6 mm

X-ray sensitive area

Vertical clock phase

2 phase

Horizontal clock phase

2 phase

Output circuit

X-ray resolution

Reliability

Package

Two-stage MOSFET source follower with load resistance

4 to 6 Lp/mm at 60 kVp, 10 m Roentgen

100,000 shots at 60 kVp, 10 m Roentgen

40 pin ceramic package

Window

FOS (Fiber Optic plate with Scintillator)

*1: Number of active pixels per chip. Two chips are used.

12 3 4 5 6 7

中文翻译

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与S7199-01相关器件

型号	品牌	获取价格	描述	数据表
S7199-01_11	HAMAMATSU	获取价格	CCD area image sensor Front-illuminated FFT-CCDs for X-ray imaging
S7199-01_15	HAMAMATSU	获取价格	TDI-CCD area image sensor
S7199-01F	HAMAMATSU	获取价格	CCD Sensor, 1536 Horiz pixels, 128 Vert pixels, 5-11V, Rectangular, Through Hole Mount, CE
S71AL016D	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02-B7	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWBF0	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWBF2	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWBF3	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWTF0	SPANSION	获取价格	Stacked Multi-Chip Product (MCP) Flash Memory and RAM

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