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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| S7199 | HAMAMATSU |
获取价格 |
CCD Sensor, 5-11V, Rectangular, Through Hole Mount |
|
| S7199-01 | HAMAMATSU |
获取价格 |
CCD area image sensor Front-illuminated FFT-CCDs for X-ray imaging |
|
| S7199-01_11 | HAMAMATSU |
获取价格 |
CCD area image sensor Front-illuminated FFT-CCDs for X-ray imaging |
|
| S7199-01_15 | HAMAMATSU |
获取价格 |
TDI-CCD area image sensor |
|
| S7199-01F | HAMAMATSU |
获取价格 |
CCD Sensor, 1536 Horiz pixels, 128 Vert pixels, 5-11V, Rectangular, Through Hole Mount, CE |
|
| S71AL016D | SPANSION |
获取价格 |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
|
| S71AL016D02 | SPANSION |
获取价格 |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
|
| S71AL016D02-B7 | SPANSION |
获取价格 |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
|
| S71AL016D02BAWBF0 | SPANSION |
获取价格 |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
|
| S71AL016D02BAWBF2 | SPANSION |
获取价格 |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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