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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| S7199 | HAMAMATSU |
获取价格 |
CCD Sensor, 5-11V, Rectangular, Through Hole Mount |
|
| S7199-01 | HAMAMATSU |
获取价格 |
CCD area image sensor Front-illuminated FFT-CCDs for X-ray imaging |
|
| S7199-01_11 | HAMAMATSU |
获取价格 |
CCD area image sensor Front-illuminated FFT-CCDs for X-ray imaging |
|
| S7199-01_15 | HAMAMATSU |
获取价格 |
TDI-CCD area image sensor |
|
| S7199-01F | HAMAMATSU |
获取价格 |
CCD Sensor, 1536 Horiz pixels, 128 Vert pixels, 5-11V, Rectangular, Through Hole Mount, CE |
|
| S71AL016D | SPANSION |
获取价格 |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
|
| S71AL016D02 | SPANSION |
获取价格 |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
|
| S71AL016D02-B7 | SPANSION |
获取价格 |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
|
| S71AL016D02BAWBF0 | SPANSION |
获取价格 |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
|
| S71AL016D02BAWBF2 | SPANSION |
获取价格 |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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