Datasheet > S7171-0909

S7171-0909

更新时间： 2024-11-19 04:06:47

品牌	Logo	应用领域
HAMAMATSU		传感器图像传感器
页数	文件大小	规格书
9页	186K
描述
CCD area image sensor 512 】 512 pixels, Back-thinned FFT-CCD

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

S7171-0909 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
Reach Compliance Code：	unknown	风险等级：	5.64
其他特性：	SENSITIVITY IS 2.20 MICRO V/ELECTRON	主体宽度：	22.4 mm
主体高度：	7.7 mm	主体长度或直径：	34 mm
动态范围：	91 dB	外壳：	CERAMIC, METAL-SEALED COFIRED
安装特点：	THROUGH HOLE MOUNT	最高工作温度：	30 °C
最低工作温度：	-50 °C	输出范围：	12-18V
输出类型：	ANALOG VOLTAGE	封装形状/形式：	RECTANGULAR
像素大小：	24X24 µm	传感器/换能器类型：	IMAGE SENSOR,CCD
光谱响应 (nm)：	200-1100	表面贴装：	NO
端接类型：	SOLDER	Base Number Matches：	1

S7171-0909 数据手册

I M A G E S E N S O R

CCD area image sensor

S7170-0909 S7171-0909

512 × 512 pixels, Back-thinned FFT-CCD

Hamamatsu developed Multi Pin-Phase (MPP) mode back-thinned FFT- CCDs S7170-0909, S7171-0909 specifically designed for low-light-level

detection in scientific applications. S7170-0909, S7171-0909 have sensitivity from the UV to near-IR as well as having low dark current and wide

dynamic range. Stability of the spectral response curve is also achieved for high precision measurements.

Either one-stage or two-stage thermoelectric cooler is built into the package (S7171-0909, S7172-0909). At room temperature operation, the

device can be cooled down to -10 ˚C by one-stage cooler and -30 ˚C by two-stage cooler, respectively. In addition since both the CCD chip and

the thermoelectric cooler are hermetically sealed, no dry air is required, thus allowing easy handling.

Features

Applications

512 × 512 pixel format

Scientific measuring instrument

Semiconductor inspection

UV imaging

Greater than 90 % quantum efficiency

at peak sensitivity wavelength

Wide spectrum range

Bio-photon observation

Low readout noise

Wide dynamic range

MPP operation

Non-cooled types: S7170-0909

One-stage TE-cooled types: S7171-0909

ꢀ Selection guide

Type No.

Active area

[mm (H) × mm (V)]

Number of active

Cooling

Number of total pixels

pixels

S7170-0909

S7171-0909

Non-cooled

532 × 520

512 × 512

12.288 × 12.288

One-stage

TE-cooled

532 × 520

512 × 512

Note) Two-stage TE-cooled type (S7172-0909) is also available.

ꢀ General ratings

Parameter

S7170-0909

S7171-0909

Pixel size

24 (H) × 24 (V) µm

512 (H) × 512 (V)

2 phase

Number of active pixels

Vertical clock phase

Horizontal clock phase

Output circuit

Package

Built-in cooler

2 phase

One-stage MOSFET source follower

24 pin ceramic DIP (refer to dimensional outlines)

One-stage

Sapphire glass *¹

Window

*1: Window-less is available upon request.

12 3 4 5 6 7...9

中文翻译

下载PDF

与S7171-0909相关器件

型号	品牌	获取价格	描述	数据表
S7171-0909-01	HAMAMATSU	获取价格	512 × 512 pixels, back-thinned FFT-CCD
S7171-45R	HARWIN	获取价格	SMT SPRING CONTACT IN TAPE AND REEL (4.00mm HIGH)
S7181-45R	HARWIN	获取价格	SMT SPRING CONTACT (4.50mm HIGH) IN TAPE AND REEL
S7183	HAMAMATSU	获取价格	Photo IC diode Linear current amplification of photodiode output
S7183_15	HAMAMATSU	获取价格	Photo IC diodes
S7184	HAMAMATSU	获取价格	Photo IC diode Linear current amplification of photodiode output
S7191-45R	HARWIN	获取价格	SMT SPRING CONTACT (5.00mm HIGH) IN TAPE AND REEL
S7199	HAMAMATSU	获取价格	CCD Sensor, 5-11V, Rectangular, Through Hole Mount
S7199-01	HAMAMATSU	获取价格	CCD area image sensor Front-illuminated FFT-CCDs for X-ray imaging
S7199-01_11	HAMAMATSU	获取价格	CCD area image sensor Front-illuminated FFT-CCDs for X-ray imaging

与S7171-0909相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

23
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

15
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

45
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

45

产品中心

服务支持

精选活动

关于我们

帮助中心

S7171-0909

S7171-0909 技术参数

S7171-0909 数据手册

与S7171-0909相关器件

与S7171-0909相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

S7171-0909

S7171-0909 技术参数

S7171-0909 数据手册

与S7171-0909相关器件

与S7171-0909相关文章

您还可以找

您在本页遇到什么问题？