Datasheet > S7171-0909-01

S7171-0909-01

更新时间： 2024-11-09 07:16:55

品牌	Logo	应用领域
HAMAMATSU		/
页数	文件大小	规格书
12页	266K
描述
512 × 512 pixels, back-thinned FFT-CCD

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

S7171-0909-01 技术参数

是否Rohs认证：	符合	生命周期：	Active
包装说明：	DIP-24	Reach Compliance Code：	unknown
风险等级：	5.76	其他特性：	SENSITIVITY IS 2.20 MICRO VOLT PER ELECTRON
主体宽度：	22.4 mm	主体高度：	8.38 mm
主体长度或直径：	34 mm	动态范围：	92.04 dB
水平像素：	512	外壳：	CERAMIC
安装特点：	THROUGH HOLE MOUNT	最高工作温度：	50 °C
最低工作温度：	-50 °C	输出接口类型：	USB INTERFACE
输出范围：	14-18V	输出类型：	ANALOG VOLTAGE
封装形状/形式：	RECTANGULAR	像素大小：	24X24 µm
传感器/换能器类型：	IMAGE SENSOR,CCD	光谱响应 (nm)：	200-1100
表面贴装：	NO	端接类型：	SOLDER
垂直像素：	512	Base Number Matches：	1

S7171-0909-01 数据手册

CCD area image sensors

S7170-0909 S7171-0909-01

512 × 512 pixels, back-thinned FFT-CCD

HAMAMATSU developed MPP (multi-pinned phase) mode back-thinned FFT-CCDs S7170-0909, S7171-0909-01 speci¿cally

designed for low-light-level detection in scienti¿c applications. The S7170-0909, S7171-0909-01 have sensitivity from the

UV to near-IR as well as having low dark current and wide dynamic range. Stability of the spectral response curve is also

achieved for high precision measurements.

Either one-stage or two-stage thermoelectric cooler is built into the package (S7171-0909-01, S7172-0909). At room tem-

perature operation, the device can be cooled down to -10 °C by one-stage cooler and -30 °C by two-stage cooler, respec-

tively. In addition since both the CCD chip and the thermoelectric cooler are hermetically sealed, no dry air is required, thus

allowing easy handling.

Features

Applications

512 × 512 pixel format

Scienti¿c measuring instrument

Semiconductor inspection

UV imaging

Greater than 90% quantum efficiency at peak sensitivity

wavelength

Wide spectrum range

Low readout noise

Wide dynamic range

MPP operation

Bio-photon observation

Non-cooled type: S7170-0909

One-stage TE-cooled type: S7171-0909-01

Selection guide

Image size

[mm (H) × mm (V)]

Number of effective

pixels

Suitable multichannel

detector head

Type no.

Cooling

Number of total pixels

532 × 520

S7170-0909

S7171-0909-01

Non-cooled

One-stage TE-cooled

C7180

C7181

512 × 512

12.288 × 12.288

Note: Two-stage TE-cooled type (S7172-0909) is also available.

Structure

Parameter

S7170-0909

S7171-0909-01

Pixel size

24 (H) × 24 (V) m

Vertical clock phase

Horizontal clock phase

Output circuit

Package

2 phases

One-stage MOSFET source follower

24-pin ceramic DIP (refer to dimensional outlines)

Window

Sapphire*¹

AR-coated sapphire

*1: Window-less type (ex. S7170-0909N) is available upon request.

(Temporary window is ¿xed by tape to protect the CCD chip and wire bonding.)

www.hamamatsu.com

12 3 4 5 6 7...12

中文翻译

下载PDF

与S7171-0909-01相关器件

型号	品牌	获取价格	描述	数据表
S7171-45R	HARWIN	获取价格	SMT SPRING CONTACT IN TAPE AND REEL (4.00mm HIGH)
S7181-45R	HARWIN	获取价格	SMT SPRING CONTACT (4.50mm HIGH) IN TAPE AND REEL
S7183	HAMAMATSU	获取价格	Photo IC diode Linear current amplification of photodiode output
S7183_15	HAMAMATSU	获取价格	Photo IC diodes
S7184	HAMAMATSU	获取价格	Photo IC diode Linear current amplification of photodiode output
S7191-45R	HARWIN	获取价格	SMT SPRING CONTACT (5.00mm HIGH) IN TAPE AND REEL
S7199	HAMAMATSU	获取价格	CCD Sensor, 5-11V, Rectangular, Through Hole Mount
S7199-01	HAMAMATSU	获取价格	CCD area image sensor Front-illuminated FFT-CCDs for X-ray imaging
S7199-01_11	HAMAMATSU	获取价格	CCD area image sensor Front-illuminated FFT-CCDs for X-ray imaging
S7199-01_15	HAMAMATSU	获取价格	TDI-CCD area image sensor

与S7171-0909-01相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

22
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

21
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

47
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

39

产品中心

服务支持

精选活动

关于我们

帮助中心

S7171-0909-01

S7171-0909-01 技术参数

S7171-0909-01 数据手册

与S7171-0909-01相关器件

与S7171-0909-01相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

S7171-0909-01

S7171-0909-01 技术参数

S7171-0909-01 数据手册

与S7171-0909-01相关器件

与S7171-0909-01相关文章

您还可以找

您在本页遇到什么问题？