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S70GL02GP13FFIV10 PDF预览

S70GL02GP13FFIV10

更新时间: 2024-11-27 04:06:47
品牌 Logo 应用领域
飞索 - SPANSION 闪存
页数 文件大小 规格书
14页 315K
描述
2 Gigabit, 3.0 Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology

S70GL02GP13FFIV10 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:LBGA, BGA64,8X8,40针数:64
Reach Compliance Code:compliantECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.7
最长访问时间:130 ns备用内存宽度:8
命令用户界面:NO通用闪存接口:YES
数据轮询:NOJESD-30 代码:R-PBGA-B64
JESD-609代码:e1长度:13 mm
内存密度:4294967296 bit内存集成电路类型:FLASH
内存宽度:16湿度敏感等级:3
功能数量:1部门数/规模:2K
端子数量:64字数:268435456 words
字数代码:256000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:256MX16封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装等效代码:BGA64,8X8,40
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE
页面大小:8/16 words并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:1.8/3.3,3/3.3 V
编程电压:3 V认证状态:Not Qualified
就绪/忙碌:YES座面最大高度:1.4 mm
部门规模:128K子类别:Flash Memories
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:40切换位:NO
类型:NOR TYPE宽度:11 mm
Base Number Matches:1

S70GL02GP13FFIV10 数据手册

 浏览型号S70GL02GP13FFIV10的Datasheet PDF文件第2页浏览型号S70GL02GP13FFIV10的Datasheet PDF文件第3页浏览型号S70GL02GP13FFIV10的Datasheet PDF文件第4页浏览型号S70GL02GP13FFIV10的Datasheet PDF文件第5页浏览型号S70GL02GP13FFIV10的Datasheet PDF文件第6页浏览型号S70GL02GP13FFIV10的Datasheet PDF文件第7页 
S70GL-P MirrorBitTM Flash  
S70GL02GP  
2 Gigabit, 3.0 Volt-only Page Mode Flash Memory featuring  
90 nm MirrorBit Process Technology  
S70GL-P MirrorBitTM Flash Cover Sheet  
Data Sheet (Advance Information)  
Notice to Readers: This document contains information on one or more products under development at  
Spansion Inc. The information is intended to help you evaluate this product. Do not design in this product  
without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this  
proposed product without notice.  
Publication Number S70GL-P_00  
Revision 01  
Issue Date December 4, 2006  

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