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S70FL01GSDPBHAC13 PDF预览

S70FL01GSDPBHAC13

更新时间: 2024-11-25 10:07:19
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
18页 1891K
描述
Flash, 128MX8, PBGA24, BGA-24

S70FL01GSDPBHAC13 数据手册

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S70FL01GS  
1 Gbit (128 Mbyte) 3.0V SPI Flash  
Features  
CMOS 3.0V Core  
Security Features  
Serial Peripheral Interface (SPI) with Multi-I/O  
– SPI Clock polarity and phase modes 0 and 3  
– Double Data Rate (DDR) option  
One Time Program (OTP) array of 1024 bytes  
Block Protection  
– Status Register bits to control protection against program  
or erase of a contiguous range of sectors.  
– Hardware and software control options  
– Advanced Sector Protection (ASP)  
– Individual sector protection controlled by boot code or  
password  
– Extended Addressing: 32-bit address  
– Serial Command set and footprint compatible with  
S25FL-A, S25FL-K, and S25FL-P SPI families  
– Multi I/O Command set and footprint compatible with  
S25FL-P SPI family  
Cypress® 65 nm MirrorBit® Technology with Eclipse  
READ Commands  
– Normal, Fast, Dual, Quad, Fast DDR, Dual DDR, Quad  
Architecture  
DDR  
Core Supply Voltage: 2.7V to 3.6V  
I/O Supply Voltage: 1.65V to 3.6V  
Temperature Range / Grade:  
– AutoBoot – power up or reset and execute a Normal or  
Quad read command automatically at a preselected  
address  
– Common Flash Interface (CFI) data for configuration  
information  
– Industrial (40 °C to +85 °C)  
– Industrial Plus (40 °C to +105 °C)  
– Extended (40 °C to +125 °C)  
Programming (1.5 Mbytes/s)  
– 512-byte Page Programming buffer  
– Quad-Input Page Programming (QPP) for slow clock  
systems  
– Automotive, AEC-Q100 Grade 3 (40 °C to +85 °C)  
– Automotive, AEC-Q100 Grade 2 (40 °C to +105 °C)  
– Automotive, AEC-Q100 Grade 1 (40 °C to +125 °C)  
Packages (all Pb-free)  
Erase (0.5 Mbytes/s)  
– Uniform 256-kbyte sectors  
Cycling Endurance  
– 100,000 Program-Erase Cycles  
Data Retention  
– 16-lead SOIC (300 mils)  
– BGA-24, 8 6 mm  
– 5 5 ball (FAB024) footprint  
– 20 Year Data Retention  
General Description  
This document contains information for the S70FL01GS device, which is a dual die stack of two S25FL512S die. For detailed  
specifications, refer to the discrete die datasheet provided in Table 1.  
Table 1. Affected Documents/Related Documents  
Document Title  
Publication Number  
S25FL512S 512 Mbit (64 Mbyte) 3.0V SPI Flash Memory Datasheet  
001-98284  
Cypress Semiconductor Corporation  
Document Number: 001-98295 Rev. *J  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised December 02, 2016  

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