Datasheet > S3MB

S3MB

更新时间： 2024-11-10 14:52:59

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WON-TOP		/
页数	文件大小	规格书
4页	40K
描述
SMD

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获取价格

数据手册

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S3MB 数据手册

S3AB – S3MB

3.0A SURFACE MOUNT GLASS PASSIVATED STANDARD DIODE

WON-TOP ELECTRONICS

Features



Glass Passivated Die Construction



Ideally Suited for Automatic Assembly

Low Forward Voltage Drop

Surge Overload Rating to 100A Peak

Low Power Loss

Built-in Strain Relief

Plastic Case Material has UL Flammability

Classification Rating 94V-0

SMB/DO-214AA

Min

Mechanical Data

Dim

Max

3.94

4.70

2.11



Case: SMB/DO-214AA, Molded Plastic

Terminals: Solder Plated, Solderable

per MIL-STD-750, Method 2026

3.30

4.06

1.91



Polarity: Cathode Band or Cathode Notch

Marking: Type Number

Weight: 0.093 grams (approx.)

Lead Free: For RoHS / Lead Free Version,

Add “-LF” Suffix to Part Number, See Page 4

0.152

5.08

0.305

5.59

2.44

0.203

1.27

2.13

0.051

0.76

All Dimensions in mm

Maximum Ratings and Electrical Characteristics @T_A=25°C unless otherwise specified

Single Phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.

Characteristic

Symbol

S3AB S3BB S3DB S3GB S3JB S3KB S3MB Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

100

200

140

400

600

420

800

560

1000

700

RMS Reverse Voltage

VR(RMS)

280

3.0

Average Rectified Output Current

@T_L= 75°C

Non-Repetitive Peak Forward Surge Current

8.3ms Single Half Sine-Wave Superimposed on

Rated Load (JEDEC Method)

IFSM

100

Forward Voltage

@I_F= 3.0A

VFM

IRM

1.15

Peak Reverse Current

@T_A= 25°C

250

µA

At Rated DC Blocking Voltage

@T_A= 125°C

Typical Junction Capacitance (Note 1)

Typical Thermal Resistance (Note 2)

Typical Thermal Resistance (Note 3)

RθJA

RθJL

°C/W

°C

Operating and Storage Temperature Range

TJ, TSTG

-65 to +150

Note: 1. Measured at 1.0 MHz and applied reverse voltage of 4.0 V DC.

2. Junction to ambient, device mounted on PCB with 8.0mm x 8.0mm copper pads.

3. Junction to lead, device mounted on PCB with 8.0mm x 8.0mm copper pads.

Revision: September, 2012

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